Flexible Display Film Segmentation for Reduced Bending Stress
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Solution Overview
Problem
Conventional flexible display configurations have a limited degree of freedom in designing the width of the curved regions in the organic light-emitting diode structure layer due to the wide horizontal width of the film required for wiring lines, leading to stress and impractical bending when attempting to curve the edges.
Innovation Solution
The display device features a film with a narrower connection region to the organic light-emitting diode structure layer and a flexible printed circuit, where the film and cover glass are curved in the same direction as the edge regions, allowing for non-overlapping bent sections that avoid the connection region, thereby reducing stress and increasing design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the horizontal width of the film is widened to accommodate wiring lines bypassing the integrated circuit arrangement region, then the wiring layout is achieved, but the connection section width increases and bending stress increases when folding the film
Solution Approach 1:
The film width is segmented into different regions: a wider first region for integrated circuit arrangement and a narrower second region for connection sections. This segmentation allows wiring lines to be laid out in the wider first region while the narrower second region minimizes bending stress during folding, resolving the contradiction between wiring layout requirements and bending stress reduction.
2Ease of manufacture
If the film width is increased to allow wiring lines to bypass the integrated circuit region, then wiring connectivity is achieved, but the degree of freedom in designing curved region width is reduced
Solution Approach 1:
The film is divided into a first region with larger width for integrated circuit arrangement and wiring connectivity, and a second region with smaller width for connection sections. This segmentation enables wiring lines to bypass integrated circuits in the first region while allowing flexible design of curved region width in the second region, thus maintaining both wiring connectivity and design freedom.
Solution Approach 2:
Different width characteristics are assigned to different regions of the film: the first region has larger width suitable for integrated circuit arrangement and wiring bypass, while the second region has smaller width suitable for connection sections and curved region design. This local quality differentiation resolves the contradiction between wiring connectivity requirements and design flexibility.
3Ease of manufacture
If the film is folded back onto the rear surface side with wide connection sections, then the chip on film structure is achieved, but bending in two directions creates excessive stress on the film
Solution Approach 1:
The film width is segmented such that the connection sections in the second region have smaller width compared to the first region. This segmentation allows the film to be folded back onto the rear surface side while minimizing bending stress in the connection sections, enabling the chip on film structure to be achieved with reduced stress.
Data Source
AI summary
There is provided a display device including an organic light-emitting diode structure layer including a pixel array section, a film connected to a first edge-side region of the organic light-emitting diode structure layer and folded back onto a rear surface side of the organic light-emitting diode structure layer, and an integrated circuit disposed on the film. A width of the film in a connection region to the organic light-emitting diode structure layer is smaller than a width of the film in a region where the integrated circuit is disposed.