Flexible Display Motherboard Grooves for Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flexible display manufacturing methods face challenges with inward shrinkage stress and warpage of flexible substrates due to film layers, affecting the manufacture and performance of flexible display motherboards and apparatuses.
Innovation Solution
The introduction of first and second grooves between groups of flexible display units, formed by etching buffer, gate insulating, and passivation layers, helps to release and disperse inward shrinkage stress, preventing substrate deformation and apparatus failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If film layers such as the buffer layer are deposited on the flexible substrate to ensure moisture isolation, then moisture isolation performance is improved, but inward shrinkage stress accumulates causing substrate warpage and deformation
Solution Approach 1:
The patent divides the flexible substrate into multiple groups of display units separated by grooves. This segmentation allows the substrate to be divided into smaller regions that can independently accommodate stress, preventing overall warpage while maintaining moisture isolation through the buffer layer deposited on each segment.
Solution Approach 2:
The patent extracts or removes material to form grooves between groups of display units. These grooves serve as stress relief zones that eliminate accumulated inward shrinkage stress from the buffer layer deposition, preventing substrate deformation while preserving the moisture barrier function in the display unit regions.
2Adaptability or versatility
If the flexible substrate is made thin and flexible to enable wearable and portable applications, then flexibility and portability are improved, but the substrate becomes more susceptible to warpage and deformation from stress
Solution Approach 1:
By segmenting the thin flexible substrate into groups separated by grooves, the patent enables each segment to maintain flexibility while the overall structure resists warpage. The grooves act as hinges or stress relief zones that allow local flexibility without compromising global flatness.
Solution Approach 2:
The patent applies different structural qualities to different regions: the display unit regions maintain thin-film flexibility for wearable applications, while the groove regions provide structural support and stress management. This local differentiation allows the substrate to be both flexible and resistant to warpage.
3Reliability
If multiple film layers are deposited during manufacturing to create the display device structure, then device functionality is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent segments the manufacturing process by creating grooves that divide the substrate into independent groups. This allows film layers to be deposited and processed in a modular manner, where each group can be manufactured and tested independently, reducing overall manufacturing complexity despite maintaining full device functionality.
Data Source
AI summary
A flexible display motherboard is disclosed. The motherboard includes a first group of flexible display units, where the first group includes at least one flexible display unit. The motherboard also includes a second group of flexible display units, where the second group includes at least one flexible display unit. The motherboard also includes one or more first grooves between the first and second groups.