Flexible Display Heat Dissipation Path Structure

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Solution Overview

Problem

Portable electronic devices with flexible displays face heat management challenges due to components like application processors, power management ICs, and communication processors, which can lead to stability issues and user safety concerns such as low-temperature burns.

Innovation Solution

A flexible display device with a heat-dissipation path structure extending across two housings, including a hinge structure and a heat sink, to efficiently transfer heat generated by heat sources, improving thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat dissipation path structure is added across first housing, hinge structure, and second housing, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation path structure integrates the first housing, hinge structure, and second housing into a unified thermal management system. The housing and hinge structure work together as a combined heat dissipation pathway, merging structural and thermal management functions to improve heat dissipation efficiency without requiring completely separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The hinge structure serves dual purposes: it provides the mechanical folding function and simultaneously acts as part of the heat dissipation path. By making the hinge structure participate in both motion support and heat transfer, the patent achieves multi-functionality that improves thermal management while avoiding additional dedicated heat dissipation components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If heat dissipation path structure is extended across hinge structure, then heat dissipation efficiency is improved, but manufacturing difficulty increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing difficulty

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The heat dissipation path is integrated into the existing housing and hinge structure manufacturing processes. By combining the heat dissipation function with the structural components that already need to be manufactured, the patent avoids the need for separate heat dissipation component fabrication and assembly, thereby reducing overall manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables rapid heat dissipation, preventing performance degradation and user discomfort by effectively managing heat in portable electronic devices with flexible displays.

Implementation Method 1

The heat-dissipation path structure transfers heat generated by the heat source to the heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11294429B2Flexible display device including heat dissipation structure

Publication Date: 2022.04.05 SAMSUNG ELECTRONICS CO LTD

AI summary

A flexible display device is provided, which includes a first housing, a second housing, a hinge structure that connects the first housing and the second housing and supports a hinge motion of the first housing or the second housing, a heat source disposed in the first housing, a heat sink disposed in the second housing, and a heat-dissipation path structure disposed across the first housing, the hinge structure, and the second housing. The heat-dissipation path structure transfers heat generated by the heat source to the heat sink.