Flexible Display Separation via Conductive Heating Layer
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Solution Overview
Problem
The existing manufacturing process for flexible displays, which involves laser scanning to separate the flexible substrate from the hard substrate, results in heat damage and high costs due to poor heat dissipation, leading to increased product failure rates and difficulty in controlling the separation process.
Innovation Solution
A conductive heating layer with a microstructure pattern is formed on a hard substrate, allowing for a heating treatment to separate the flexible substrate layer, which is then formed with a heat dissipation layer and base layers, enabling controlled heat dissipation and reducing damage to the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If laser scanning is used to separate the flexible substrate from the hard substrate, then the separation process can be automated, but the heat damage to the flexible substrate and TFT circuit increases
Solution Approach 1:
A release layer is introduced as an intermediary between the flexible substrate and the hard substrate. This release layer has controlled adhesion properties that allow the flexible substrate to be easily detached from the hard substrate without requiring high-energy laser scanning, thereby automating the separation process while minimizing heat damage to the flexible substrate and TFT circuit.
Solution Approach 2:
The adhesion strength between the flexible substrate and the hard substrate is controlled by adjusting the properties of the release layer. By changing parameters such as the thickness, material composition, and surface energy of the release layer, the separation process can be optimized to occur at lower temperatures, reducing heat damage while maintaining automation capability.
2Ease of manufacture
If laser scanning is used to separate the hard substrate and the flexible display, then the separation can be achieved, but the cost increases
Solution Approach 1:
The release layer serves as a cost-effective intermediary that enables separation without requiring expensive laser scanning equipment. The release layer can be applied using standard coating techniques during the manufacturing process, and its presence allows for simple mechanical or thermal separation methods, thereby reducing production costs while maintaining separation capability.
Solution Approach 2:
The release layer is applied in advance during the manufacturing process, before the flexible display is fully assembled. This preliminary action ensures that the separation capability is built into the structure from the beginning, eliminating the need for expensive post-assembly separation processes and reducing overall production costs.
3Ease of manufacture
If the flexible substrate is manufactured on a hard substrate, then the manufacturing process can be simplified, but the heat dissipation effect during separation is poor
Solution Approach 1:
The release layer acts as a thermal intermediary with optimized thermal conductivity properties. It allows heat to be efficiently dissipated from the flexible substrate during the separation process, preventing heat accumulation and damage while maintaining the simplified manufacturing approach of fabricating the flexible substrate on a hard substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and service life of flexible displays by avoiding damage from laser energy, enhancing light extraction efficiency, and reducing production costs through controlled heat separation.
Implementation Method 1
performing a heating treatment on the conductive heating layer to separate the flexible substrate layer from the conductive heating layer
Implementation Method 2
forming a heat dissipation layer and a second flexible base layer on the first flexible base layer sequentially
Data Source
AI summary
A manufacturing method of a flexible display device and a flexible display device are provided. The manufacturing method of the flexible display device includes: forming a conductive heating layer with a first microstructure pattern on a hard substrate; forming a flexible substrate layer on the conductive heating layer, and forming a display device on the flexible substrate layer; performing a heating treatment on the conductive heating layer to separate the flexible substrate layer from the conductive heating layer, and a side of the flexible substrate layer away from the display device having a second microstructure pattern after being separated.


