Flexible Display Inorganic Layer Crack Suppression
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Solution Overview
Problem
Flexible displays manufactured using a cutting process suffer from panel shrinkage and display failures due to cracks in the inorganic layers spreading to the thin film encapsulation layer during the cutting of scribe lines, causing damage and loss of encapsulation function.
Innovation Solution
Incorporating an opening in the inorganic layer between the flexible substrate and the thin film encapsulation layer, filled with an organic material such as a urethane-based, epoxy-based, or acryl-based resin, to block the spread of cracks and prevent panel shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If strong pressure is applied to cut scribe lines during the manufacturing process, then the cutting efficiency is improved, but cracks are generated in the inorganic layers which spread to the thin film encapsulation layer causing panel shrinkage
Solution Approach 1:
The inorganic layer is segmented by forming openings (through-holes) at specific positions between the flexible substrate and the thin film encapsulation layer. These openings divide the continuous inorganic layer into separate sections, preventing crack propagation across the entire layer while maintaining the protective function in intact areas.
Solution Approach 2:
An organic material layer is introduced as an intermediary substance filling the openings formed in the inorganic layer. This organic material acts as a buffer and stress distributor, absorbing cutting forces and preventing direct transmission of stress that would cause cracks to spread to the thin film encapsulation layer.
2Strength
If the inorganic layer is made continuous to provide protection, then the protective function is improved, but crack spread during cutting causes loss of encapsulation function
Solution Approach 1:
The inorganic layer is intentionally segmented by forming openings that divide it into multiple protected zones. This segmentation prevents crack propagation while each remaining section maintains its protective function locally, balancing protection with crack resistance.
Solution Approach 2:
The inorganic layer is modified locally by forming openings at specific positions where stress concentration occurs during cutting. The openings are strategically placed in non-critical areas, maintaining protective quality in essential regions while introducing vulnerability only where it prevents harmful crack spread.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the spread of cracks to the thin film encapsulation layer, improving production yield by preventing panel shrinkage and display failures, thereby enhancing the reliability of flexible displays.
Implementation Method 1
the opening is formed in the inorganic layer of the flexible display device so that spread of cracks toward the thin film encapsulation can be blocked
Data Source
AI summary
A flexible display device that can suppress spread of cracks of an inorganic layer is provided. A flexible display device includes a flexible substrate including a display area and a periphery surrounding the display area, an inorganic layer formed on the flexible substrate, a display unit formed on the display area, and a thin film encapsulation layer covering the display unit. The inorganic layer includes an opening disposed on a periphery between edges of the flexible substrate and the thin film encapsulation layer.