Flexible Display Substrate Separation via Laser Ablation
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Solution Overview
Problem
Current flexible display manufacturing methods face challenges in forming high-quality, void-free organic light-emitting display apparatuses that are resistant to external oxygen and moisture, while also requiring a method to separate the flexible substrate from a carrier substrate without damaging the thin film transistor (TFT) and organic light-emitting diode (OLED) structures.
Innovation Solution
A method involving the sequential formation of a flexible substrate, TFT, OLED, and attachment layers on a carrier substrate, followed by deposition layers and sealing films, with laser-sealing and heat-bonding to secure the sealing film to the flexible substrate, and finally separating the flexible substrate using a laser beam to detach it from the carrier substrate, while applying a UV sealant to prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the flexible substrate is separated from the carrier substrate using conventional methods, then the manufacturing process can proceed, but the TFT and OLED structures may be damaged
Solution Approach 1:
A release layer is formed between the flexible substrate and carrier substrate before the TFT and OLED structures are completely finalized. This preliminary preparation enables clean separation at an optimal point in the manufacturing process, preventing damage to the delicate TFT and OLED structures while allowing the flexible substrate to be successfully separated from the carrier substrate.
2Object-affected harmful factors
If the sealing film is applied to protect against oxygen and moisture, then the display apparatus becomes resistant to external factors, but voids may form reducing adhesion quality
Solution Approach 1:
A release layer acts as an intermediary between the flexible substrate and carrier substrate, enabling controlled separation that prevents void formation. This intermediary layer facilitates clean detachment while maintaining the integrity of the sealing film's adhesion to the flexible substrate, ensuring both protective function and manufacturing precision.
3Reliability
If multiple layers are laminated to ensure sealing integrity, then the display apparatus achieves high reliability, but the manufacturing process becomes more complex
Solution Approach 1:
The release layer is integrated into the existing multi-layer structure of the flexible display apparatus, combining the separation function with the sealing and protective layers. This merging approach maintains high sealing integrity through proper layer integration while avoiding the need for separate, complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of flexible display apparatuses with improved adhesion strength and moisture resistance, reducing voids and ensuring the integrity of the TFT and OLED structures during separation, thus enhancing the overall quality and reliability of the flexible display units.
Implementation Method 1
separating the flexible substrate and the sealing film from the carrier substrate may include irradiating a laser beam from an outside of the carrier substrate, such that a structure including the flexible substrate, the TFT, the OLED including the first electrode, the intermediate layer, and the second electrode, and the first attachment layer is separated from the carrier substrate
Implementation Method 2
Sealing the first and second attachment layers may include laser-sealing and heat-bonding the first and second attachment layers at a predetermined position
Implementation Method 3
The method may further include spreading an ultraviolet (UV) sealant along an edge of the flexible substrate, and curing the ultraviolet (UV) sealant
Data Source
AI summary
A method of manufacturing a flexible display apparatus includes sequentially forming a flexible substrate, a thin film transistor (TFT), an organic light-emitting diode (OLED) including a first electrode, an intermediate layer, and a second electrode, and a first attachment layer on a carrier substrate, sequentially forming a deposition layer and a second attachment layer on a sealing film, attaching the carrier substrate and the sealing film to each other such that the sealing film covers flexible substrate on the carrier substrate, sealing the first and second attachment layers, laminating the carrier substrate and the sealing film, and separating the sealing film and the flexible substrate from the carrier substrate.