Flexible Display Substrate Laser Peeling and Resin Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for a display device manufacturing method that simplifies the process, improves productivity, and enhances reliability while achieving a thinner and lighter form factor, particularly for mobile information terminal devices, while also ensuring effective sealing and protection against the environment.
Innovation Solution
The method involves preparing first and second resin substrates with island-shaped resin layers, forming display elements and mounting portions, attaching them with a protection layer, and using laser ablation to peel off support substrates, allowing for the integration of a flexible printed circuit board opposed to a protection layer for enhanced sealing and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If flexible display panel and flexible printed circuit are connected via flexible printed circuit, then the display device achieves thinner and lighter form factor, but the manufacturing process becomes more complex and reliability is compromised
Solution Approach 1:
The patent applies preliminary action by forming a resin layer that extends from the end portion of the display element portion along the mounting portion onto the support substrate before final assembly. This pre-formed protective resin layer seals the mounting portion where the flexible printed circuit connects, preventing external environment intrusion before reliability issues can occur. The resin layer is prepared in advance during substrate fabrication, ensuring sealing integrity is built into the structure prior to component assembly.
2Productivity
If traditional manufacturing process is used, then reliability is maintained, but productivity is low and manufacturing process is complex
Solution Approach 1:
The patent merges multiple functions into the resin layer structure. The resin layer simultaneously serves as: (1) a sealing barrier protecting against external environment, (2) a protective coating for the mounting portion, and (3) an integrated structural element formed during standard substrate fabrication. This consolidation eliminates the need for separate sealing steps and additional protective components, simplifying the manufacturing process while maintaining reliability and enabling mass production.
3Object-affected harmful factors
If resin sheets are thermocompression-bonded for sealing, then protection against external environment is enhanced, but manufacturing process becomes more complex and productivity decreases
Solution Approach 1:
The patent extracts the sealing function from the complex multi-step thermocompression bonding process and integrates it directly into the substrate fabrication process. Instead of applying separate resin sheets and performing thermocompression bonding, the invention forms the protective resin layer directly on the support substrate during standard manufacturing steps. This extraction of the essential sealing function simplifies the process while maintaining environmental protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of thinner, lighter display devices with improved reliability and productivity, effectively sealing and protecting the internal components, and reducing the risk of damage during substrate peeling.
Implementation Method 1
peeling the second support substrate from the second resin layer by radiating a laser beam toward the second substrate
Implementation Method 2
peeling the first support substrate from the first resin layer by radiating a laser beam toward the first substrate
Data Source
AI summary
According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate formed such that a first resin layer is formed on a first support substrate, and thereafter a display element portion and a mounting portion are formed above the first resin layer and a protection layer, which extends from an end portion of the first resin layer along the mounting portion onto the first support substrate, is disposed, preparing a second substrate formed such that a second resin layer is formed on a second support substrate, attaching the first substrate and the second substrate, and mounting a flexible printed circuit board, which is in a state in which the flexible printed circuit board is opposed to the protection layer, on the mounting portion.