Flexible Display Lamination and Laser Release for Yield Stability
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Solution Overview
Problem
The manufacturing of flexible display devices faces challenges with minute defective portions that increase yield loss and reduce display quality and reliability, particularly due to warping or bending after completion, which are not significant issues with rigid substrates.
Innovation Solution
A method for manufacturing flexible display devices involving the use of an oxide semiconductor layer, with specific steps including forming organic resin layers, insulating films, and bonding substrates to enclose element layers, followed by separation using excimer laser irradiation to reduce adhesion and a curved roller for separation, ensuring high-quality and reliable displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flexible display devices are manufactured using conventional methods with rigid substrates, then manufacturing yield is maintained, but warping and bending defects occur after completion that reduce display quality and reliability
Solution Approach 1:
The patent changes the fundamental parameter of substrate rigidity by using flexible substrates instead of rigid substrates. This parameter change allows the display device to accommodate bending and warping without generating defective portions, thereby improving display quality and reliability while maintaining manufacturing yield.
Solution Approach 2:
The patent introduces dynamic flexibility to the display device structure, allowing it to adapt to bending and warping conditions. By designing the substrate and encapsulation layers to be flexible rather than rigid, the device can dynamically respond to mechanical stress without generating defects that would reduce reliability.
2Reliability
If flexible substrates are used to prevent warping and bending, then display quality improves, but manufacturing complexity increases due to additional processing steps
Solution Approach 1:
The patent applies preliminary action by forming the organic resin layer and inorganic insulating film on the flexible substrate before completing the device assembly. This preliminary structuring allows the flexible components to be in place during manufacturing, enabling the device to maintain its flexible properties throughout the manufacturing process while reducing overall manufacturing complexity.
Solution Approach 2:
The patent uses an organic resin layer as an intermediary between the flexible substrate and the inorganic insulating film. This intermediary layer facilitates the integration of flexible and rigid components, allowing the device to achieve both flexibility and structural integrity without significantly increasing manufacturing complexity.
3Productivity
If separation processes are used to remove substrates, then manufacturing yield improves, but adhesion reduction and potential damage to element layers occur
Solution Approach 1:
The patent replaces mechanical separation methods with laser beam processing. By using a laser beam to irradiate the organic resin layer, the adhesive force between the flexible substrate and the resin layer is reduced through thermal or chemical effects, allowing for clean separation without mechanical stress that could damage the element layers. This substitution of mechanical separation with optical/thermal processing improves manufacturing yield while preserving layer integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of flexible display devices with improved display quality and reliability by minimizing defective portions and maintaining high manufacturing yield, utilizing an oxide semiconductor layer and specific processing techniques to address warping and bending issues.
Implementation Method 1
separation using excimer laser irradiation to reduce adhesion
Data Source
AI summary
A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.