Flexible Display Substrate Separation via Laser Decomposition
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Solution Overview
Problem
The existing methods for manufacturing flexible display devices face challenges in completely peeling off the flexible substrate from the hard support without damaging the display element layer, which can lead to incomplete separation and substrate reuse issues.
Innovation Solution
A method involving a sacrificial layer, metal layer, buffer layer, and flexible layer is used, where the sacrificial layer is melted and decomposed using laser irradiation to separate it from the metal layer, allowing for complete removal and reuse of the hard substrate, while the display element layer is securely bonded to the flexible layer using hot-pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the flexible substrate is peeled off from the hard support completely, then the substrate can be reused and manufacturing efficiency improves, but the display element layer may be damaged during the peeling process
Solution Approach 1:
The invention divides the substrate structure into multiple layers: a flexible substrate layer, a buffer layer, and a sacrificial layer. The sacrificial layer is specifically designed to be removed separately from the flexible substrate, allowing the substrate to be peeled from the hard support without compromising the display element layer. This segmentation enables complete substrate reuse while protecting the display elements.
Solution Approach 2:
The sacrificial layer acts as an intermediary between the flexible substrate and the hard support. It is configured to bond with both the substrate and the support, but can be selectively removed through laser irradiation or chemical etching. This intermediary layer facilitates complete peeling of the substrate from the support while preventing direct stress transmission to the display element layer during separation.
2Productivity
If a sacrificial layer is introduced to enable complete peeling, then substrate reuse is enabled, but the device structure becomes more complex
Solution Approach 1:
The sacrificial layer is designed as a temporary, disposable component that is removed after serving its purpose of enabling substrate peeling. It can be made from inexpensive materials such as photoresist or specific polymers that are easily removable. This approach justifies the temporary structural addition by enabling complete substrate reuse, which significantly improves manufacturing efficiency and reduces waste.
3Manufacturing precision
If laser irradiation is used to decompose the sacrificial layer, then complete separation is achieved, but energy consumption increases
Solution Approach 1:
The sacrificial layer is designed with specific material properties that make it responsive to laser irradiation at particular wavelengths and power levels. By selecting materials with appropriate absorption coefficients and thermal properties, the laser processing parameters can be optimized to achieve complete decomposition of the sacrificial layer with minimal energy consumption. The layer thickness and composition are tuned to match the laser parameters for efficient energy transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures complete separation of the flexible substrate from the hard support, enabling efficient production of flexible display devices with minimal damage and allowing for the reuse of the hard substrate, thereby improving manufacturing efficiency and reducing waste.
Implementation Method 1
the sacrificial layer is melted and decomposed using laser irradiation
Implementation Method 2
the sacrificial layer is melted and decomposed using laser irradiation
Implementation Method 3
the sacrificial layer is melted and decomposed using laser irradiation
Implementation Method 4
the display element layer is securely bonded to the flexible layer using hot-pressing
Data Source
AI summary
A method for making a flexible display device includes: providing a hard substrate and sequentially forming a sacrificial layer, a metal layer, a buffer layer, and a flexible layer on the hard substrate; forming a display element layer on a surface of the flexible layer away from the buffer layer; hot pressing a laminate formed by the display element layer, the flexible layer, the buffer layer, the metal layer, the sacrificial layer, and the hard substrate to make the display element layer to bond to the flexible layer; laser irradiating the laminate from a side of the hard substrate to make the metal layer and the sacrificial layer peel off from each other.