Flexible Display Metal Sheet Grounding and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible display devices face challenges in maintaining low resistance and effective heat dissipation due to complex stack structures and increased thickness, which can lead to performance degradation when bent or folded.
Innovation Solution
Incorporating a metal sheet and a heat dissipation layer between the circuit board and the support member, bonded with adhesive films, to simplify the stack structure and enhance electrical connectivity and heat dissipation, while minimizing resistance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a complex stack structure is used in flexible display devices, then structural support is improved, but resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent combines the support member and ground wire into an integrated structure where the support member serves dual functions as both mechanical support and electrical ground path. This merging eliminates the need for separate ground wires running through multiple layers, reducing resistance while maintaining structural integrity.
Solution Approach 2:
The patent segments the ground connection path by providing multiple ground wires distributed across different regions of the circuit board, each connected to the support member. This segmentation creates parallel electrical paths that reduce overall resistance while distributing the structural load.
2Strength
If a complex stack structure is used in flexible display devices, then structural support is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent merges the heat dissipation function into the support member by making it electrically conductive and connecting it to ground wires. The support member thus serves as both mechanical support and heat dissipation pathway, conducting heat away from the circuit board to the chassis or frame.
Solution Approach 2:
The support member acts as an intermediary between the circuit board and the external environment (chassis/frame), transferring both mechanical support and thermal energy. This intermediary role enables efficient heat dissipation without requiring separate heat sink components.
3Reliability
If the stack structure is simplified, then resistance decreases and heat dissipation improves, but structural support deteriorates
Solution Approach 1:
The support member is designed with multi-functionality, serving simultaneously as mechanical support, electrical ground path, and heat dissipation component. This universal role allows structure simplification while maintaining or improving resistance and heat dissipation characteristics.
Solution Approach 2:
By combining multiple functions (support, grounding, heat dissipation) into the single support member, the patent achieves structure simplification without compromising performance. The integrated design eliminates redundant components while maintaining structural integrity through the support member's inherent strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes low resistance and improves heat dissipation characteristics, maintaining performance even when the display is bent, by simplifying the stack structure and leveraging the conductive and thermal properties of the metal sheet and heat dissipation layer.
Implementation Method 1
a metal sheet disposed between the circuit board and the support member, bonded to the circuit board by a first adhesive film, and bonded to the support member by a second adhesive film
Implementation Method 2
a heat dissipation layer disposed between the circuit board and the support member, including a first opening which exposes the support member, and including graphite
Data Source
AI summary
A display device includes a display panel, a support member disposed under the display panel, a circuit board electrically connected to the display panel and disposed under the support member, and a metal sheet disposed between the circuit board and the support member, bonded to the circuit board by a first adhesive film, and bonded to the support member by a second adhesive film.