Flexible Display Organic Buffer Layer Prevents Inorganic Crack
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible displays face the challenge of crack generation in inorganic layers during the cutting process, which can lead to damage and reduced image quality due to external forces and panel modifications, necessitating additional patterning processes that increase manufacturing time and cost.
Innovation Solution
The flexible display design includes extending organic layers to cover inorganic layers on the cutting line, using materials like the overcoat layer or bank layer to buffer external forces and prevent direct contact with cutting means, thereby preventing crack generation in inorganic layers and ensuring product reliability and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the inorganic layer is exposed at the end of the flexible substrate during cutting, then the cutting process can be simplified, but cracks are generated in the inorganic layer due to external forces
Solution Approach 1:
An organic layer is introduced as an intermediary between the inorganic layer and the external cutting environment. The organic layer extends to the end of the flexible substrate and contacts the cutting means first, preventing direct contact between the cutting tool and the inorganic layer, thereby preventing crack generation while maintaining manufacturing simplicity
Solution Approach 2:
The organic layer is designed to extend beyond the inorganic layer at the ends of the flexible substrate before the cutting process begins. This pre-positioned organic layer acts as a cushioning buffer that absorbs the impact and stress of the cutting process, protecting the inorganic layer from cracks before the cutting actually occurs
2Reliability
If additional patterning processes are added to protect inorganic layers, then crack prevention is improved, but manufacturing time and cost increase
Solution Approach 1:
The organic layer is formed to extend to the ends of the flexible substrate during the initial manufacturing process, before the cutting operation. This preliminary configuration of the organic layer provides built-in protection against cracks during cutting, eliminating the need for additional patterning processes that would otherwise be required to protect the inorganic layer
3Reliability
If the organic layer extends to cover the inorganic layer at the end, then crack prevention is achieved, but the device structure becomes more complex
Solution Approach 1:
The organic layer serves multiple functions: it provides electrical insulation, environmental protection, and now additionally serves as a protective buffer during the cutting process. By extending the organic layer's existing functionality to also protect against cutting-induced cracks, the patent avoids adding separate protective structures, thereby minimizing increased device complexity while achieving crack prevention
Data Source
AI summary
A flexible display is disclosed. The flexible display includes a flexible substrate and a thin film transistor array positioned on the flexible substrate and including a thin film transistor, an organic light emitting diode, inorganic layers, and organic layers. At least one of the inorganic layers is exposed to a side of the flexible substrate. At least one of the organic layers is positioned on the at least one inorganic layer and is exposed to the side of the flexible substrate.