Flexible Display Package With Conductive Adhesion Layer Integration
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Solution Overview
Problem
The integration of additional electronic components in wearable devices, such as GPS and heart rate sensing modules, increases the size and weight of the housing, negatively impacting user experience.
Innovation Solution
A semiconductor device package is developed, comprising a display device with a TFT layer on a flexible substrate, an electronic module with electronic components on another flexible substrate, and a conductive adhesion layer connecting them, which provides a stable and efficient electrical connection without increasing the device's size or weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional electronic components (GPS module, heart rate sensing module) are integrated into the housing, then functionality is improved, but size and weight of the housing increase
Solution Approach 1:
The patent combines multiple electronic components (display device, GPS module, heart rate sensing module) into a single integrated housing structure. The display device is positioned on the front surface while electronic components are arranged on the rear surface, merging multiple functions into one unified device that maintains compact size while providing enhanced functionality.
Solution Approach 2:
The patent utilizes the third dimension (depth/thickness) by arranging components on different surfaces of the housing. The display device occupies the front surface while electronic components are placed on the rear surface, effectively using vertical space to accommodate multiple functions without increasing the horizontal footprint or overall weight significantly.
2Adaptability or versatility
If additional electronic components are integrated into the housing, then functionality is improved, but size of the housing increases
Solution Approach 1:
Multiple electronic components are merged into a single integrated housing structure with optimized component arrangement. The display device and electronic components share the same housing space, reducing overall device size compared to separate components.
Solution Approach 2:
The patent exploits the depth dimension by positioning the display device on the front surface and electronic components on the rear surface of the housing. This vertical arrangement allows multiple functions to coexist within a compact footprint, minimizing the horizontal area occupied by the device.
3Reliability
If components are connected using conventional methods, then electrical connection is achieved, but alignment precision and conductivity consistency deteriorate
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary substance between the display device and electronic components. This conductive adhesive serves dual functions: providing mechanical adhesion for precise alignment and ensuring consistent electrical conductivity across all connections, thereby improving both alignment precision and conductivity reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a compact and lightweight wearable device with improved electrical performance by ensuring consistent conductivity and precise alignment of components, enhancing user experience through reduced bulk and enhanced functionality.
Implementation Method 1
The conductive adhesion layer is disposed between the first substrate and the second substrate
Data Source
AI summary
A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.