Flexible Display Panel Adhesion via Through Hole Design

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Solution Overview

Problem

The manufacturing process of film layers in display panels results in weakened adhesion between layers, leading to peeling when the panel is bent, thereby shortening its service life.

Innovation Solution

A display panel design featuring a flexible substrate with an array layer, pixel definition layer, insulating layer with specific through holes, light-emitting layer, additional layer, and inorganic layers, where the second through holes are designed with top diameters less than bottom diameters and second parts of the additional layer are not connected, enhancing adhesion between layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional film layer manufacturing process is used, then manufacturing simplicity is maintained, but adhesion between film layers deteriorates leading to peeling during bending

Engineering Contradiction:
Improveadhesion between film layersVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent divides the through holes into two distinct types: first through holes filled with light-emitting layer material, and second through holes containing additional layer material. This segmentation allows different regions to serve different functions - the first through holes provide light emission while the second through holes enhance adhesion between the array layer and encapsulation layers, preventing peeling during bending without compromising manufacturing feasibility

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different materials and structures to different locations within the display panel. Specifically, the additional layer material is selectively placed in second through holes at specific positions where adhesion enhancement is most needed, while light-emitting layer material is placed in first through holes. This localized approach optimizes adhesion strength at critical interfaces without unnecessarily complicating the entire structure

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If film layers are bent after manufacturing, then flexibility is achieved, but adhesion between layers deteriorates causing peeling

Engineering Contradiction:
Improvebending capabilityVSAvoidadhesion between film layers
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent performs preliminary adhesion enhancement by filling second through holes with additional layer material before the bending process occurs. This additional layer material creates strong bonding between the array layer and encapsulation layers in advance, so when bending occurs later, the pre-established adhesion prevents peeling. The through holes are prepared and filled during manufacturing, ensuring adhesion strength is established before flexibility is utilized

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses composite material structures where the additional layer material is combined with the array layer and encapsulation layers through the second through holes. This creates a multi-material composite structure that maintains strong interlayer adhesion during bending, while the overall device retains flexibility. The composite structure of different materials working together prevents peeling under mechanical stress

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11943972B2Display panel and manufacturing method thereof
Publication Date: 2024.03.26 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US11943972B2 patent drawing
  • US11943972B2 patent drawing
  • US11943972B2 patent drawing

AI summary

The present disclosure provides a display panel and a manufacturing method thereof, which include a flexible substrate, an array layer, a pixel definition layer, an insulating layer, a light-emitting layer, an additional layer, and a first inorganic layer. The array layer, the pixel definition layer, and the insulating layer are sequentially disposed on the flexible substrate, the insulating layer includes first through holes and second through holes, the light-emitting layer is filled in the first through holes, and the additional layer is disposed on the pixel definition layer, in the second through holes, and on the insulating layer and the light-emitting layer. The first inorganic layer is disposed on the array layer and the additional layer.