Flexible Display Substrate with Photo-Decomposable Auxiliary Layer
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Solution Overview
Problem
The existing methods for creating flexible display panels with narrow bezels face challenges in reducing bending stress and simplifying the process of removing film layers in bending regions, which can lead to poor workmanship and damage to upper circuits.
Innovation Solution
A flexible display substrate is designed with a bending region that includes a back film, a first flexible base substrate, a second flexible base substrate, and an auxiliary layer, where the auxiliary layer is decomposed in a preset condition, such as being irradiated by light of a specific wavelength, to form a gap and allow for easy removal of the back film and first flexible base substrate, reducing bending stress and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If film layers are removed in the bending region to reduce bending stress, then the flexibility and narrow bezel are improved, but the workmanship quality deteriorates and upper circuits may be damaged
Solution Approach 1:
The film layer structure is segmented into multiple functional layers: the auxiliary layer (sacrificial layer) that is selectively removed, and the other film layers (including upper circuits) that are maintained. This segmentation allows the auxiliary layer to bear the removal stress while protecting the other film layers from damage, resolving the contradiction between flexibility improvement and workmanship quality maintenance.
Solution Approach 2:
The auxiliary layer acts as an intermediary or sacrificial element between the bending region requirements and the upper circuits. By removing the auxiliary layer first, it mediates the stress and protection requirements, enabling safe removal of film layers to achieve narrow bezel while protecting the upper circuits from damage.
2Stress or pressure
If film layers are removed in the bending region, then bending stress is reduced, but the process complexity and workmanship difficulty increase
Solution Approach 1:
The auxiliary layer is pre-formed with specific material properties (photo-decomposable or heat-decomposable characteristics) before the final assembly is completed. This preliminary action enables controlled, selective removal of only the auxiliary layer through decomposition, simplifying the overall process by avoiding complex mechanical removal steps and reducing workmanship difficulty while effectively reducing bending stress.
Solution Approach 2:
The mechanical removal process is replaced by a chemical/physical decomposition process. Instead of mechanically removing film layers (which increases process complexity and workmanship difficulty), the auxiliary layer is decomposed through light irradiation or heating, automatically creating gaps and reducing bending stress through a simpler, more controllable process.
3Ease of manufacture
If the auxiliary layer is decomposed to form a gap, then the removal process is simplified and bending stress is reduced, but additional processing steps are required
Solution Approach 1:
The auxiliary layer is designed with specific material parameters (photo-decomposable or heat-decomposable properties) that enable controlled decomposition. By changing the material parameter of the auxiliary layer to be selectively decomposable, the removal process is simplified and made more controllable. The decomposition can be achieved through light irradiation or heating, which are efficient processes that do not significantly reduce productivity while greatly simplifying the removal operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the removal of film layers in bending regions, reduces bending stress, and prevents damage to upper circuits by decomposing the auxiliary layer to create a gap, facilitating the bending of the flexible display substrate while maintaining other film layers in their original state.
Implementation Method 1
at least part of the auxiliary layer in the bending region is decomposed when satisfying a preset condition, and the other film layers except the auxiliary layer are maintained at the original state in the preset condition
Data Source
AI summary
A flexible display substrate and a manufacturing method therefor, and a display apparatus, for relieving the problem that it is difficult to bend the flexible display substrate in a bending region to damage an upper circuit. The flexible display substrate comprises a back film, a first flexible base substrate located above the back film, and a second flexible base substrate located on one side of the first flexible base substrate facing away from the back film. The flexible display substrate has a bending region. An auxiliary layer is further provided between the first flexible base substrate and the second flexible base substrate. At least part of the auxiliary layer in the bending region can be decomposed in a preset condition, wherein the other film layers except the auxiliary layer are maintained at the original status in the preset condition.