Flexible Display Terminal Short-Circuit Prevention via Resin Mediator
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Solution Overview
Problem
In flexible organic EL display devices, conductive particles in anisotropic conductive films can aggregate and short-circuit adjacent terminals due to the distance-keeping means in LSI-chip-mounting, leading to terminal short-circuiting issues.
Innovation Solution
A display device design featuring a flexible substrate with a thin film transistor layer and light-emitting element layer, including a frame area with terminal sections and a chip-mounting portion where chip-use terminals are arranged in a single row, and chip support bodies are provided between terminals to manage conductive particles, preventing interconnection and short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If distance-keeping means is disposed straddling over multiple terminals to restrain warping, then panel stability is improved, but conductive particles aggregate and interconnect between terminals causing short-circuiting
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the distance-keeping means and the terminals. This resin layer prevents direct contact between conductive particles and terminals while maintaining the distance-keeping function, thus eliminating short-circuiting risk while preserving panel stability.
Solution Approach 2:
The distance-keeping means is designed with through-holes that segment the conductive particle distribution path. These through-holes create isolated regions that prevent conductive particles from forming continuous conductive paths between adjacent terminals, thereby preventing short-circuits while maintaining structural stability.
2Reliability
If conductive particles are densely distributed to ensure good electrical connection, then electrical conductivity is improved, but risk of interconnection between adjacent terminals increases
Solution Approach 1:
The resin layer thickness is varied locally - thicker in regions between terminals to prevent particle interconnection, and thinner in regions above terminals to ensure good electrical contact. This local variation in quality allows simultaneous achievement of high conductivity and low interconnection risk.
Solution Approach 2:
The resin layer serves as a mediator that controls conductive particle distribution. It allows particles to maintain good contact with terminals while preventing their aggregation and interconnection in the spaces between terminals, thus resolving the contradiction between conductivity and interconnection risk.
Data Source
AI summary
On a chip-mounting portion, a plurality of chip-use terminals are provided in a single row, and a plurality of terminal lines are provided extending parallel to each other in such a manner as to correspond to the plurality of chip-use terminals and being electrically connected respectively to the plurality of chip-use terminals, and a chip support body is provided between the plurality of chip-use terminals.