Flexible Display Sealing Layer for Driving Chip Pin Protection
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Solution Overview
Problem
Conventional flexible displays face reliability issues due to the rigidity of driving chip pins and trace layer defects when separating from rigid substrates, leading to broken pins and broken lines.
Innovation Solution
The flexible display apparatus employs a chip on film (COF) technique with driving chips on flexible circuit boards, encapsulated by a sealing layer that covers the periphery and bonding area, using an anisotropic conductive film for electrical connection, and includes an external circuit for enhanced structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible display panel is separated from the rigid substrate after bonding the driving chip with rigid pins, then the flexible display can be removed from the manufacturing substrate, but the rigid pins of the driving chip are likely to be broken or the trace layer is likely to have broken lines
Solution Approach 1:
The patent replaces the conventional rigid substrate with a flexible substrate that has elastic properties. The flexible substrate can bend and deform without breaking, allowing the driving chip to be bonded to the flexible substrate while maintaining the integrity of the chip pins and trace layers during the separation process from the manufacturing substrate.
Solution Approach 2:
The patent changes the mechanical properties of the substrate from rigid to flexible by using a flexible substrate with elastic characteristics. This parameter change allows the substrate to withstand bending and deformation stresses during separation, preventing breakage of the driving chip pins and trace layers while maintaining structural integrity.
2Ease of manufacture
If a rigid substrate is used for manufacturing the flexible display panel, then the manufacturing process can be stable, but the driving chip pins and trace layer are vulnerable to breakage during separation
Solution Approach 1:
The patent uses a flexible substrate instead of a rigid substrate for manufacturing. The flexible substrate maintains manufacturing stability while its elastic properties prevent breakage of driving chip pins and trace layers during separation, thus improving the integrity of the driving chip connection.
Solution Approach 2:
The patent employs a composite structure combining the flexible substrate with the driving chip and trace layers. This composite material approach allows the flexible substrate to provide both manufacturing stability and protection against breakage, ensuring the reliability of the driving chip connection during the separation process.
Data Source
AI summary
A flexible display apparatus including a flexible display panel, at least one flexible circuit board, at least one driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.