Flexible Display Substrate Peeling via Separation Pattern Layer
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Solution Overview
Problem
The manufacturing of flexible display substrates is challenging due to the difficulty in accurately fixing and peeling the flexible substrate from a rigid support substrate without causing deformation or damage, leading to low yield and high costs.
Innovation Solution
A method involving a separation pattern layer with thermally deformable or gas/liquid-filled units on a support substrate, combined with an adhesion layer, allows for uniform gap generation between the flexible and support substrates during peeling, facilitating easy separation and reducing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the flexible substrate is firmly combined with the support substrate, then the position and flatness are accurately fixed, but the peeling process causes deformation and displacement of electronic elements
Solution Approach 1:
The support substrate is divided into multiple separable sections or layers, allowing the flexible substrate to be peeled off in segments rather than as a whole, reducing deformation stress on electronic elements during separation
Solution Approach 2:
An intermediary layer or release coating is introduced between the flexible substrate and support substrate, facilitating easy separation while maintaining firm bonding during the manufacturing process, thus enabling accurate positioning without peeling deformation
2Ease of manufacture
If conventional peeling methods are used, then the flexible substrate can be separated from the support substrate, but excessively long time is consumed or the flexible display substrate is easily damaged
Solution Approach 1:
The mechanical peeling process is replaced with thermal or chemical methods. Heating the support substrate to a specific temperature or applying a chemical solution weakens the adhesion between substrates, enabling rapid and damage-free separation without excessive time consumption
Solution Approach 2:
The adhesion parameters between substrates are dynamically changed during the process. Strong adhesion is maintained during manufacturing, then adhesion is reduced through temperature or chemical parameter changes to enable quick peeling, improving both ease of manufacture and productivity
3Measurement precision
If a laser beam is used for peeling processing, then the peeling can be controlled, but the laser beam unavoidably damages the display elements due to their thin pattern layers
Solution Approach 1:
A laser-absorbing intermediary layer is placed between the laser beam and the thin pattern layers of display elements. This intermediary layer absorbs the laser energy and converts it to thermal energy for controlled peeling, protecting the display elements from direct laser damage while maintaining peeling precision
Solution Approach 2:
The direct laser peeling method is replaced with indirect thermal processing. The laser heats an intermediary layer or the support substrate rather than directly irradiating the thin pattern layers, achieving controlled peeling without damaging the display elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield and reduces manufacturing costs by ensuring smooth peeling of the flexible display substrate without deformation, improving the overall efficiency of the process.
Implementation Method 1
forming, on a support substrate, a separation pattern layer comprising a plurality of separation units arranged at intervals
Data Source
AI summary
Embodiments of the present invention disclose a method of manufacturing a flexible display substrate. The method includes steps of: forming, on a support substrate, a separation pattern layer comprising a plurality of separation units arranged at intervals; forming an adhesion layer on the support substrate formed with the separation pattern layer; forming a flexible base substrate on the adhesion layer and forming a display element on a side of the flexible base substrate opposite to the adhesion layer; performing a peeling preprocessing on the support substrate, and peeling the flexible base substrate from the support substrate to form the flexible display substrate.


