Flexible Display Laser Separation via Silicon Nitride Composition
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Solution Overview
Problem
Current methods for fabricating flexible display devices require an additional process for forming a separation layer between the carrier substrate and the plastic substrate, which increases process time and expense, and often result in the loss of the barrier layer during separation.
Innovation Solution
A method that uses a barrier layer on the plastic substrate instead of a separation layer, allowing for the separation of the carrier substrate from the plastic substrate using a laser beam focused on a silicon nitride separation layer with a specific composition ratio, maintaining contact with the barrier layer and preventing loss of the barrier layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional separation layer is formed between the carrier substrate and plastic substrate, then the separation process becomes feasible, but the process time and manufacturing complexity increase
Solution Approach 1:
The patent combines the barrier layer and separation layer into a single integrated layer. This layer simultaneously provides moisture barrier functionality and laser-induced separation capability, eliminating the need for a separate dedicated separation layer and reducing the number of fabrication steps
Solution Approach 2:
The barrier layer is designed to serve multiple functions: it acts as both a moisture barrier to protect the flexible substrate and a separation layer that can be selectively removed via laser irradiation. This multi-functionality eliminates the need for additional specialized layers
2Reliability
If a traditional separation layer is used, then separation can be achieved, but the barrier layer is lost during separation
Solution Approach 1:
The separation layer is designed with a specific composition (silicon nitride with controlled N/Si ratio) that allows selective removal via laser irradiation. The segmentation principle is applied by creating a distinct compositional region within the barrier layer that can be selectively decomposed without affecting the underlying flexible substrate's barrier layer
Solution Approach 2:
The patent utilizes parameter changes in the separation layer composition (specific N/Si ratio in silicon nitride) to enable selective laser decomposition. By controlling the chemical composition parameters, the layer becomes susceptible to laser-induced decomposition at specific wavelengths while leaving the barrier layer intact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient separation of the carrier substrate from the flexible substrate without the need for a separation layer, reducing process time and expense, while maintaining protection for the flexible substrate through the remaining separation layer.
Implementation Method 1
separating the first carrier substrate from the flexible substrate by directing a laser beam onto the first separation layer
Implementation Method 2
directing a laser beam onto the first separation layer
Data Source
AI summary
A method of fabricating a flexible display device. The method includes forming an adhesive layer on a first carrier substrate; laminating a first flexible substrate on the adhesive layer, so that a first separation layer of the first flexible substrate is disposed on the adhesive layer; forming a thin film transistor array on the first flexible substrate; and separating the first carrier substrate from the flexible substrate by directing a laser beam onto the first separation layer. The first separation layer comprises silicon nitride (SiNx) with amounts of nitride A1 and amounts of silicon B1 satisfying 0.18≦{A1/B1}≦0.90.