Flexible Display Panel IC Bonding via Stiffening Component Support
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Solution Overview
Problem
Flexible display panels tend to curl or fold when separated from glass substrates, leading to alignment issues during IC chip bonding, which complicates the bonding process and reduces accuracy.
Innovation Solution
The use of stiffening components with encapsulation layers and supporting pads to provide structural support to the flexible display body, preventing curling and folding, and ensuring accurate alignment and bonding of IC chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser is used to separate the flexible display body from the glass substrate, then the flexible display body can be obtained, but the flexible display body curls or folds due to its thinness
Solution Approach 1:
The patent introduces a support film (a type of flexible shell) that is attached to the back surface of the flexible display body. This support film provides mechanical reinforcement to prevent curling and folding while maintaining the flexibility needed for the display application. The support film acts as a stabilizing layer that counteracts the inherent instability of the thin flexible display body after laser separation from the glass substrate.
2Adaptability or versatility
If the flexible display body is made thinner to improve flexibility, then flexibility is enhanced, but the body becomes susceptible to curling and folding
Solution Approach 1:
The patent creates a composite structure by combining the thin flexible display body with a support film having different mechanical properties. This composite construction allows the system to exhibit both the flexibility of the thin display body and the structural stability of the support film, effectively resolving the contradiction between flexibility and strength.
3Manufacturing precision
If no support structure is added to maintain flatness, then the fabrication process remains simple, but alignment accuracy during IC chip bonding deteriorates
Solution Approach 1:
The support film is attached to the back surface of the flexible display body before the IC chip bonding process. This preliminary action ensures that the display body maintains its flatness and stability throughout subsequent processing steps, including alignment and bonding operations, thereby improving manufacturing precision without significantly complicating the overall fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents curling and folding of flexible display panels, enabling more accurate and efficient bonding of IC chips, improving the overall fabrication process and reducing production complexities.
Implementation Method 1
the first stiffening component comprises an encapsulation layer with a water-repellent layer and a surface-adhesive layer, the water-repellent layer being attached on the surface-adhesive layer and the surface-adhesive layer being attached on the front surface of the flexible display body
Implementation Method 2
the substrate is separated from the first stiffening component and the flexible display body by laser or by a punching process
Data Source
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AI summary
The present disclosure provides a method for bonding an integrated circuit (IC) chip (3) onto a flexible display body (1). The method includes providing a substrate having a flexible display body (1) thereon, and aligning a first stiffening component (8) with the flexible display body (1) having an IC bonding region. The method further includes attaching the first stiffening component (8) onto a front surface of the flexible display body (1), and separating the substrate from the first stiffening component (8) and the flexible display body (1) to expose a back surface of the flexible display body (1); and bonding an IC chip (3) onto the IC bonding region.