Flexible Display Substrate Apertures for Laser Release Deformation

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Solution Overview

Problem

Flexible display panel substrates face deformation issues during high-temperature manufacturing processes, particularly due to heat and gas generated by high-energy lasers, which affect the pitch of bonding pads and complicate subsequent processes.

Innovation Solution

A manufacturing method involving a substrate body with a supporting surface and signal circuits, where apertures are formed through the substrate body and not shielded by the signal circuits, allowing for separation from a transparent carrier plate using high-energy light etching, reducing deformation and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If high-energy laser is used to release the flexible substrate from the carrier, then the substrate can be separated from the carrier, but heat and gas generated cause substrate deformation and change the pitch of bonding pads

Engineering Contradiction:

Improvesubstrate release from carrierVSAvoidsubstrate deformation and bonding pad pitch

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The substrate is divided into a flexible substrate portion and a support substrate portion that remain connected through connection portions. This segmentation allows the flexible substrate to be released from the carrier while maintaining structural integrity through the remaining connection portions, preventing deformation and pitch changes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Connection portions are formed in advance between the flexible substrate and support substrate before the release process. These pre-formed connections serve as anchors that prevent substrate deformation during the high-energy laser release process, ensuring bonding pad pitch remains unchanged.

Inventive Principle:

Principle #10Preliminary action

2Device complexity

If the flexible substrate is used directly in high-temperature manufacturing processes, then the manufacturing process can be simplified, but the substrate undergoes deformation due to heat sensitivity

Engineering Contradiction:

Improvemanufacturing process complexityVSAvoidsubstrate shape stability

Core Design Contradiction:

Device complexityVSStability of the object's composition

Solution Approach 1:

A support substrate is introduced as an intermediary element that provides thermal stability during manufacturing processes. The support substrate acts as a mediator between the heat source and the heat-sensitive flexible substrate, preventing deformation while allowing the manufacturing process to proceed.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system combines the flexible substrate and support substrate into a composite structure where each material contributes its advantageous properties. The support substrate provides thermal stability and structural support, while the flexible substrate maintains its flexibility and functional properties, creating a stable composite that can withstand manufacturing processes.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method minimizes substrate deformation and enhances the yield of display module substrates by creating apertures for gas escape and using a sacrificial layer to reduce attachment loss during the releasing process, thereby stabilizing the substrate and improving subsequent processing steps.

Implementation Method 1

etching the bottom surface by high-energy light through the transparent carrier plate to separate the substrate body from the transparent carrier plate

Methodology Applied

Scientific EffectHigh-energy light etching: Laser Ablation

Implementation Method 2

the apertures are not shielded by the signal circuits... allowing for separation from a transparent carrier plate using high-energy light etching, reducing deformation

Methodology Applied

Scientific EffectGas escape through apertures:

Data Source

PatentUS9887215B2Display module manufacturing method and display module

Publication Date: 2018.02.06 AU OPTRONICS CORP

AI summary

A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.