Flexible Display Substrate Buffer Layer for Wiring Breakage
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Solution Overview
Problem
Flexible display substrates face issues with metal wiring breakage during chip bonding due to deformation and warpage, exacerbated by the rigidity of inorganic layer structures, leading to unstable circuit performance.
Innovation Solution
A display substrate with a flexible filling layer between connection terminals, formed by etching and filling with a flexible material, provides a buffer effect to absorb stress and reduce the risk of metal wiring breakage, while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If inorganic structure layers are used to provide structural support, then structural strength is improved, but flexibility and stress absorption deteriorate
Solution Approach 1:
The patent combines inorganic structure layers with organic flexible filling layers to create a composite structure. The inorganic layers provide structural strength and support, while the organic filling layers provide flexibility and stress absorption, resolving the contradiction between strength and flexibility.
Solution Approach 2:
The patent applies different material properties to different regions: inorganic structure layers are positioned where structural support is needed, while organic flexible filling layers are positioned in regions requiring stress absorption and flexibility. This local differentiation resolves the contradiction by optimizing each region for its specific function.
2Stability of the object's composition
If rigid inorganic layers are used to maintain structural integrity, then structural stability is improved, but stress absorption and crack prevention deteriorate
Solution Approach 1:
The patent creates a composite structure where rigid inorganic layers maintain structural stability while soft organic filling layers absorb stress and prevent crack propagation. The combination allows the structure to be both stable and reliable under stress.
Solution Approach 2:
The organic flexible filling layers are positioned in advance between the inorganic structure layers to cushion and absorb stress before it can cause damage. This preemptive cushioning prevents crack propagation and maintains reliability while preserving structural stability.
3Reliability
If flexible filling layer is added to absorb stress, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent uses thin flexible filling layers that can be deposited as continuous films over the inorganic structure layers. This approach adds stress absorption functionality without significantly increasing structural complexity, as the flexible layers conform to the existing structure rather than requiring additional complex components.
Solution Approach 2:
The organic flexible filling layers serve multiple functions: they absorb stress, prevent crack propagation, provide insulation, and maintain structural integrity. This multi-functionality improves reliability without proportionally increasing device complexity, as a single layer performs multiple protective roles.
Data Source
AI summary
A display substrate, a method for preparing the same, and a display device are provided in the embodiments of the disclosure. The display substrate comprises: a flexible substrate, the flexible substrate defining a connection region thereon; an inorganic structure layer on a side of the flexible substrate and in the connection region; a plurality of connection terminals on the inorganic structure layer and in the connection region; and a flexible filling layer in the inorganic structure layer and between two adjacent connection terminals of the plurality of connection terminals.