Flexible Display Substrate Structure for Heat-Resistant Insulation
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Solution Overview
Problem
Plastic substrates used in flexible displays suffer from inferior heat resistance, thermal conductivity, and electrical insulation compared to glass substrates, leading to issues like deformation and afterimages during high-temperature manufacturing processes.
Innovation Solution
A substrate for display devices comprising a first polyimide resin layer with a Td1% of 570°C or more and a yellowness index of 25 to 60, a second polyimide resin layer with a yellowness index of less than 25, and inorganic material layers of specific thicknesses positioned between and on these resin layers to enhance heat resistance and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a plastic substrate is used to achieve lightweight and flexible properties, then adaptability and ease of manufacture are improved, but heat resistance and electrical insulation deteriorate
Solution Approach 1:
The patent employs a composite structure consisting of multiple polyimide resin layers with different yellowness indices and inorganic material layers. This composite material approach combines the flexibility and light weight of plastic substrates with the heat resistance and electrical insulation properties of inorganic materials, resolving the contradiction between adaptability and reliability.
Solution Approach 2:
The patent applies local quality by using polyimide resin layers with different yellowness indices (25-60 for the first layer, less than 25 for the second layer) and positioning inorganic material layers at specific locations. This creates zones with different functional properties within the same substrate, allowing the substrate to exhibit both flexibility and heat resistance in different regions.
2Productivity
If a plastic substrate is used to enable continuous manufacturing process, then productivity is improved, but manufacturing precision deteriorates due to deformation in high-temperature processes
Solution Approach 1:
The patent controls the yellowness index parameter of polyimide resin layers (first layer: 25-60, second layer: less than 25) and the thickness of inorganic material layers (100-700 nm for first layer, 100-500 nm for second layer). These parameter optimizations enable the substrate to maintain dimensional stability during high-temperature continuous manufacturing processes while preserving flexibility.
Solution Approach 2:
The composite structure of multiple polyimide layers with different optical properties and inorganic material layers provides both the flexibility needed for continuous manufacturing and the thermal stability required to prevent deformation, thereby resolving the contradiction between productivity and manufacturing precision.
3Temperature
If polyimide resin layers are used to achieve heat resistance, then temperature resistance is improved, but optical quality deteriorates due to high yellowness index
Solution Approach 1:
The patent applies local quality by using a first polyimide resin layer with a higher yellowness index (25-60) that provides heat resistance, combined with a second polyimide resin layer having a lower yellowness index (less than 25) that maintains optical quality. This spatial differentiation of material properties allows the substrate to exhibit both heat resistance and good optical characteristics.
Solution Approach 2:
The composite structure combines polyimide resin layers with different yellowness indices and inorganic material layers to achieve a balance between heat resistance and optical quality. The inorganic material layers further enhance heat resistance while the second polyimide layer with low yellowness index ensures good optical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate maintains optical and mechanical stability during high-temperature processes, reducing deformation and afterimages, while ensuring high resistance and device stability by blocking air and moisture, thus providing a high-quality display device substrate.
Implementation Method 1
blocking air and moisture
Implementation Method 2
heat resistance characteristics, without causing a film deformation even in high-temperature processes
Implementation Method 3
electrical insulation property
Data Source
AI summary
The present disclosure relates to a substrate for a display device or a flexible display device that realizes low dielectric properties and excellent heat resistance, and a display device or a flexible display device using the same.


