Flexible Display Thermal Control for Slide-In and Slide-Out States
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Solution Overview
Problem
Electronic devices with flexible displays face degraded system performance due to a single temperature control policy for heating elements, which does not account for different heat discharge structures during slide-in or slide-out states.
Innovation Solution
An electronic device with a flexible display includes a sensor circuit to detect slide-in or slide-out states, temperature sensors adjacent to heating elements, and a processor to adjust temperature control policies based on these states, employing different execution policies for heating elements based on their temperature and state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single execution policy is used for temperature control of heating elements, then the device structure remains simple, but system performance degrades because the policy does not account for different heat discharge structures during slide-in and slide-out operations
Solution Approach 1:
The patent implements dynamic temperature control policies that adapt based on the real-time state of the flexible display (slid-in or slid-out). The processor selects different execution policies according to the detected display state, allowing the temperature control system to dynamically adjust heating element operation parameters. This resolves the contradiction by making the control policy flexible and state-dependent rather than static, thereby improving system performance without requiring permanent structural complexity.
Solution Approach 2:
The patent changes the control parameters of heating elements based on the flexible display state. Different execution policies modify parameters such as heating power, duration, and intensity according to whether the display is in slid-in or slid-out configuration. This allows the system to optimize thermal management for each state, improving overall system performance while maintaining a relatively simple control architecture through parameter adjustment rather than structural complexity.
2Temperature
If different execution policies are implemented for temperature control based on display state, then heat dissipation performance improves, but device complexity increases due to multiple sensor circuits and control policies
Solution Approach 1:
The patent employs a multi-functional temperature control system where a single processor and sensor circuit infrastructure serves multiple purposes. The same temperature sensors and execution policies are used across different display states (slid-in and slid-out), with the processor intelligently selecting appropriate policies based on state detection. This universal approach improves heat dissipation performance across all states while avoiding the need for completely separate control systems for each state, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent implements feedback mechanisms where temperature sensors continuously monitor heating element temperatures and the sensor circuit detects flexible display states. This feedback information is fed back to the processor, which adjusts the execution policy accordingly. The feedback loop enables effective temperature control and heat dissipation adaptation to different states without requiring complex open-loop control structures, improving thermal management while maintaining reasonable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation performance and ensures maximum device performance by adapting temperature control policies to the device's state, enhancing operational efficiency.
Implementation Method 1
at least one temperature sensor disposed adjacent to at least one heating element
Implementation Method 2
controlling the at least one heating element to operate according to a first execution policy
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a flexible display including a sliding plate and a bendable section, a multi-bar structure supporting the bendable section, a sensor circuit configured to detect a first state in which at least a part of the bendable section enters an internal space of the housing or a second state in which at least a part of the bendable section is drawn out from the housing, at least one temperature sensor, and a processor. The processor obtains a temperature of one or more heating elements through the at least one temperature sensor in the first state, identifies at least one heating element having a temperature higher than a designated temperature, and controls the at least one heating element having the temperature higher than the designated temperature to operate according to a first execution policy.