Flexible Display Panel Through Hole Organic Coating
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Solution Overview
Problem
Flexible display panels face limitations in bidirectional deformation and small-curvature folding due to structural and material strain limits, requiring partial perforation to achieve greater deformation, which results in defects such as incomplete organic film formation and direct contact between the thin film encapsulation layer and the glass substrate, complicating separation and affecting structural integrity.
Innovation Solution
A flexible display panel design featuring a through hole with an organic coating layer on the hole wall and a thin film encapsulation layer extending along the organic coating layer's side, reducing direct contact with the glass substrate and facilitating non-destructive separation by forming a complete organic film layer and improving encapsulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible substrate is partially perforated to improve bidirectional deformation capability, then the deformation range is improved, but the organic film formation becomes incomplete and the thin film encapsulation layer directly contacts the glass substrate
Solution Approach 1:
The through hole is segmented into functional zones: an organic coating layer is applied to the hole wall to prevent direct contact between the encapsulation layer and glass substrate, while the hole bottom remains open to allow organic film deposition. This segmentation resolves the contradiction by creating distinct functional regions within the through hole structure.
Solution Approach 2:
An organic coating layer is introduced as an intermediary substance on the hole wall surface. This coating layer acts as a mediator that prevents direct contact between the thin film encapsulation layer and the glass substrate, while still allowing the organic film to be deposited at the hole bottom. The intermediary coating resolves the manufacturing precision issue caused by direct contact.
2Ease of manufacture
If the thin film encapsulation layer directly contacts the glass substrate through the through hole, then the separation process becomes complicated, but the structural integrity is compromised
Solution Approach 1:
The organic coating layer serves as an intermediary that prevents direct contact between the encapsulation layer and glass substrate. This intermediary layer allows for clean separation during manufacturing while maintaining the structural integrity of the flexible substrate, as the coating can be removed or separated without damaging the underlying structures.
Solution Approach 2:
The organic coating layer is applied in advance to the hole wall before the encapsulation process. This preliminary action prepares the surface to prevent direct contact, ensuring that when separation is needed, the encapsulation layer can be cleanly separated from the glass substrate without compromising structural integrity.
3Stability of the object's composition
If the through hole is used to achieve larger deformation amounts, then the flexibility is improved, but the encapsulation reliability deteriorates due to direct contact
Solution Approach 1:
The organic coating layer acts as a protective intermediary on the hole wall, preventing direct contact between the encapsulation layer and glass substrate. This maintains encapsulation reliability while allowing the through hole to provide the necessary flexibility and deformation capability for the flexible display panel.
Data Source
AI summary
Provided are a flexible display panel, a manufacturing method thereof, and a display device. The flexible display panel includes: a flexible substrate including a first surface and a second surface opposite to each other and a through hole that penetrates the flexible substrate in a direction from the first surface to the second surface; an organic coating layer disposed on a hole wall of the through hole; and a thin film transistor layer, a pixel unit and a thin film encapsulation layer that are stacked on the first surface, wherein orthographic projections of the thin film transistor layer and the pixel unit on the second surface are disposed at a side of an orthographic projection of the through hole on the second surface, and the thin film encapsulation layer extends along a side of the organic coating layer distal from the hole wall. By providing the organic coating layer, a contact area of direct contact between the thin film encapsulation layer and a glass substrate at a shielding position is reduced, such that the difficulty in separating the flexible substrate from the glass substrate is reduced.