Flexible Display Panel Through-Hole Insulation Stress Distribution
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Solution Overview
Problem
Conventional flexible display panels with laminated inorganic insulating layers struggle to meet the increasing requirements for bendability, leading to potential damage and reduced performance when subjected to bending forces.
Innovation Solution
A flexible display panel design featuring a thin film transistor layer with through-holes in the insulating layers, filled with an organic planarization layer, which distributes stresses and enhances bending resistance by replacing inorganic materials with organic ones, thereby improving the panel's physical bendability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional laminated inorganic insulating layers are used in flexible display panels, then the panel structure maintains good electrical insulation and manufacturing stability, but the bendability and flexibility of the panel deteriorate due to stress concentration during bending
Solution Approach 1:
The patent divides the continuous inorganic insulating layers into segmented structures by introducing through-holes that penetrate through the insulating layers. This segmentation allows the structure to flex during bending while maintaining electrical insulation in the remaining material regions, resolving the contradiction between insulation stability and bendability.
Solution Approach 2:
The patent introduces through-holes to create a porous structure within the insulating layers. This porous design reduces stress concentration during bending operations while the organic planarization layer fills the holes to maintain electrical insulation, thereby improving bendability without sacrificing insulation reliability.
2Reliability
If inorganic insulating layers are used to ensure electrical insulation, then the panel achieves good insulation performance, but the bending resistance and physical bendability are reduced due to the rigid nature of inorganic materials
Solution Approach 1:
The patent changes the material parameter from rigid inorganic materials to flexible organic materials for the planarization layer that fills the through-holes. This parameter change allows the structure to maintain electrical insulation while gaining flexibility and bending resistance, directly resolving the contradiction between insulation reliability and bending strength.
Solution Approach 2:
The patent creates a composite structure by combining inorganic insulating layers with organic planarization layer filling the through-holes. This composite material approach leverages the electrical insulation properties of inorganic materials while incorporating the flexibility and bending resistance of organic materials, simultaneously achieving both insulation reliability and bending resistance.
3Adaptability or versatility
If through-holes are introduced to improve bendability, then the flexibility and stress distribution are enhanced, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies preliminary action by forming the through-holes in the insulating layers before final assembly, and filling them with organic planarization layer in advance. This preliminary structuring simplifies subsequent manufacturing steps and reduces overall structural complexity while maintaining the flexibility benefits of the through-hole design.
4Reliability
If through-holes are created in the insulating layers to distribute stresses, then bending damage is reduced, but the manufacturing precision and process difficulty increase
Solution Approach 1:
The patent employs a porous structure with through-holes that are strategically designed to distribute bending stresses. The organic planarization layer filling these holes maintains insulation while the hole structure itself provides stress distribution, achieving bending damage resistance. The standardized porous pattern helps manage manufacturing precision requirements.
Data Source
AI summary
A flexible display panel and a flexible array substrate are provided, which include a flexible substrate, a thin film transistor layer, and an organic planarization layer. The thin film transistor layer is disposed on the flexible substrate and in a display area and includes a plurality of insulating layers disposed in a stack, wherein, a surface of the thin film transistor layer away from the flexible substrate is provided with first through-holes penetrating at least one of the insulating layers. The organic planarization layer covers one side of the thin film transistor layer away from the flexible substrate and is filled in the first through-holes.