Flexible Display Circuit Layout for Seamless Tiled Boundaries
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Tiled displays suffer from reduced display quality due to visible bezels at the boundaries between adjacent display devices, which degrade the overall viewing experience.
Innovation Solution
The display device design incorporates a circuit board positioned under the substrate layer, connected through a connection line within the substrate, reducing the visibility of boundaries and enhancing display quality by minimizing dead space and preventing heat or pressure transfer during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is positioned at the boundary between adjacent display devices, then electrical connection is achieved, but the bezel becomes visible and display quality decreases
Solution Approach 1:
The circuit board is repositioned from a lateral boundary position to an under-substrate position, changing its spatial dimension from horizontal to vertical. This allows the circuit board to be hidden beneath the flexible substrate while maintaining electrical connection functionality, eliminating the visible bezel problem.
Solution Approach 2:
The flexible substrate acts as a covering layer that conceals the circuit board positioned underneath it. The substrate's flexibility allows it to conform over the circuit board structure, hiding the circuit board from view while maintaining the electrical connection pathway through the substrate.
2Reliability
If the circuit board is bonded during manufacturing, then electrical connection is established, but heat and pressure may transfer and cause damage
Solution Approach 1:
The flexible substrate serves as an intermediary layer between the bonding process and the sensitive components. During bonding, the substrate can be temporarily separated or positioned to prevent direct heat and pressure transfer to the circuit board and other sensitive components, while still allowing the bonding operation to proceed.
Solution Approach 2:
The circuit board is positioned and preliminary connections are established before the final bonding process. This allows the bonding to occur on already-positioned components, reducing the need for high heat and pressure during the bonding step that could damage sensitive elements.
3Manufacturing precision
If the circuit board is positioned under the substrate, then boundary visibility is reduced and display quality improves, but the structure becomes more complex
Solution Approach 1:
The circuit board is merged with the under-substrate region, combining the electrical connection function with the structural support function. This integration reduces the need for separate mounting structures and simplifies the overall device architecture despite the changed positioning.
Solution Approach 2:
The flexible substrate serves multiple functions: it provides the display surface, acts as a protective cover for the circuit board, enables flexibility and bending, and facilitates the hiding of the circuit board boundary. This multi-functionality reduces the need for additional components to achieve the same effects.
Data Source
AI summary
A display device includes a first substrate having a flexibility, a thin film transistor layer disposed on the first substrate, where the thin film transistor layer includes a thin film transistor, a first circuit board disposed under the first substrate, and a second circuit board electrically connecting the first circuit board and the thin film transistor to each other. A portion of the second circuit board is disposed between the first substrate and the thin film transistor layer.