Flexible Display Transfer Process for Thin Film Encapsulation

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Solution Overview

Problem

The existing methods for fabricating flexible display devices are complex and result in increased thickness due to the need for multiple lamination processes, which can lead to vulnerabilities from moisture and oxygen exposure.

Innovation Solution

A method involving the use of a transfer process to form a thin film encapsulation layer, touch screen panel, and optical layer over a flexible display panel, simplifying the fabrication process and reducing thickness by directly applying these layers using heat or light transfer techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple lamination processes are used to form encapsulation layer, touch screen panel, and optical layer, then the display device achieves complete layer formation, but the fabrication process becomes complex and thickness increases

Engineering Contradiction:

Improveprotection against moisture and oxygenVSAvoidfabrication process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate lamination processes into a single integrated transfer process. The transfer sheet is prepared with multiple layers (encapsulation layer, touch screen panel, and optical layer) already stacked in sequence, allowing all layers to be transferred to the flexible display panel in one operation. This merging of processes reduces fabrication complexity while maintaining complete layer formation for protection against moisture and oxygen.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation layer, touch screen panel, and optical layer are pre-assembled on the transfer sheet before the transfer process. This preliminary arrangement of layers on the transfer sheet allows them to be positioned and bonded to the flexible display panel simultaneously, simplifying the fabrication process while ensuring proper layer formation for device protection.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If multiple lamination processes are used to form encapsulation layer, touch screen panel, and optical layer, then all necessary layers are formed, but the display device thickness increases

Engineering Contradiction:

Improveprotection against moisture and oxygenVSAvoiddisplay device thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

By combining multiple lamination processes into a single transfer process where the encapsulation layer, touch screen panel, and optical layer are transferred together in one operation, the patent reduces the cumulative thickness that would result from multiple separate bonding operations. The integrated approach maintains necessary protective layers while minimizing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If traditional lamination process is used, then fabrication is straightforward, but the process is complex and results in increased thickness

Engineering Contradiction:

Improvefabrication process simplicityVSAvoidfabrication process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The transfer sheet serves as an intermediary carrier that holds the encapsulation layer, touch screen panel, and optical layer in a pre-assembled configuration. This intermediary allows all layers to be transferred to the flexible display panel in a single operation, simplifying the fabrication process while avoiding the complexity of multiple separate lamination steps.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the fabrication process and reduces the thickness of the display device, enhancing its durability and reducing the risk of moisture and oxygen exposure.

Implementation Method 1

providing heat or light to the first transfer sheet, thereby transferring the first transfer layer over the thin film encapsulation layer

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

providing heat or light to the first transfer sheet, thereby transferring the first transfer layer over the thin film encapsulation layer

Methodology Applied

Scientific EffectLight transfer: Light

Implementation Method 3

a first expansion layer formed over the first base film; and the first transfer layer formed over the first expansion layer

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 4

providing heat or light to the first transfer sheet, thereby transferring the first transfer layer over the thin film encapsulation layer

Methodology Applied

Scientific EffectPhoto expansion:

Data Source

PatentUS9905620B2Method for fabricating display device and display device

Publication Date: 2018.02.27 SAMSUNG DISPLAY CO LTD

AI summary

Provided is a method for fabricating a display device. The method for fabricating the display device includes preparing a flexible display panel including a plurality of pixels and a thin film transistor connected to at least one of the plurality of pixels, forming a thin film encapsulation layer over the flexible display panel, and forming a touch screen panel over the thin film encapsulation layer. The touch screen panel is formed at least partly by a transfer process.