Flexible Display Device Transfer Manufacturing
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Solution Overview
Problem
Existing flexible display devices face challenges in manufacturing flexible substrates with high temperature processes, which can compromise the flexibility and efficiency of integrating light emitting diodes and thin film transistors.
Innovation Solution
A method involving the transfer of separately formed thin film transistors and light emitting diodes using a high temperature process to a flexible substrate, with an adhesion layer to secure them, allowing for the creation of active matrix pixels without exposing the substrate to high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high temperature process is used to form light emitting diodes and thin film transistors on a flexible substrate, then the manufacturing precision and reliability of the components are improved, but the flexibility and structural integrity of the substrate deteriorate due to temperature limitations
Solution Approach 1:
The patent divides the manufacturing process into separate stages: first forming the light emitting diode on a first substrate, then forming the thin film transistor on a second substrate, and finally transferring both components to the flexible substrate. This segmentation allows each component to be manufactured under optimal high temperature conditions independently, while the flexible substrate is only exposed to low temperature during the transfer and assembly stage, thus resolving the contradiction between manufacturing precision and substrate temperature tolerance.
Solution Approach 2:
The light emitting diode and thin film transistor are preliminarily formed on their respective carrier substrates using high temperature processes before being transferred to the flexible substrate. This preliminary action enables the components to achieve high manufacturing precision and reliability through high temperature processing, while the flexible substrate remains protected from high temperature exposure that would compromise its flexibility and structural integrity.
2Adaptability or versatility
If light emitting diodes and thin film transistors are formed separately and then transferred to the flexible substrate, then the manufacturing flexibility and component quality are improved, but the device complexity and manufacturing process steps increase
Solution Approach 1:
The manufacturing process is segmented into distinct modules: LED formation on first substrate, TFT formation on second substrate, and final assembly on flexible substrate. Each module can be optimized independently, allowing for manufacturing flexibility and adaptability. The segmentation enables separate process optimization while the standardized transfer interfaces manage the overall process complexity.
Solution Approach 2:
First and second substrates serve as intermediary carrier substrates that facilitate the separate formation and subsequent transfer of the light emitting diode and thin film transistor to the flexible substrate. These intermediary substrates enable independent manufacturing of each component under optimal conditions while providing a systematic approach to manage the complexity of the overall manufacturing process through standardized transfer procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing of flexible display devices by maintaining substrate flexibility and enabling the integration of light emitting diodes and thin film transistors, enhancing the flexibility and functionality of the display.
Implementation Method 1
an adhesion layer disposed on a surface of the flexible substrate, and a plurality of pixel structures in respective pixels on the adhesion layer
Data Source
AI summary
A flexible display device includes a flexible substrate, an adhesion layer disposed on a surface of the flexible substrate, and a plurality of pixel structures in respective pixels on the adhesion layer. Each of the pixel structures on the adhesion layer includes a light emitting diode including an inorganic light emitting layer, and a thin film transistor which is connected to the light emitting diode and switches a state of the light emitting diode.