Flexible Display Wiring Layout for Bend Stress Reliability
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Solution Overview
Problem
Conventional flexible electronic devices face issues with reduced reliability due to wiring breakage when bent excessively, limiting their screen space and functionality.
Innovation Solution
The design incorporates a flexible substrate with a first and second conductive layer, an organic layer, and a resilient structure, where the second conductive layer has portions that contact the first conductive layer, allowing for stress distribution and enhanced reliability by hiding the wiring area behind the display, thus minimizing frame size and improving flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wiring is disposed in the frame area, then electrical connectivity is achieved, but the frame area increases reducing screen space
Solution Approach 1:
The patent moves the wiring area from the traditional planar frame area into the third dimension by folding it behind the display area. The flexible substrate is bent to create an overlapping region where the wiring area is positioned behind the display area, effectively utilizing vertical space rather than horizontal space, thus minimizing the visible frame area while maintaining electrical connectivity.
Solution Approach 2:
The wiring area is nested within the frame area by folding the flexible substrate such that the wiring region overlaps with and is positioned behind the display area. This nesting arrangement allows the wiring to be contained within the overall device footprint without increasing the visible frame size, as the wiring area is effectively hidden within the structural layers.
2Adaptability or versatility
If the flexible electronic device is bent with low radius of curvature or excessive times, then flexibility is achieved, but wiring breaks reducing reliability
Solution Approach 1:
The patent provides beforehand cushioning by creating a folded configuration with overlapping layers and buffer regions that can absorb bending stress. The flexible substrate is pre-formed with folds and overlapping areas that act as stress-absorbing zones, protecting the wiring from breaking when the device is bent excessively or with low radius of curvature.
Solution Approach 2:
The patent utilizes flexible substrates and thin film structures that can accommodate bending without breaking. The flexible substrate is designed with appropriate thickness and material properties to allow repeated bending while maintaining wiring integrity, and the overlapping layer configuration provides additional mechanical protection during flexing operations.
Data Source
AI summary
An electronic device having a first area and a second area adjacent to the first area is provided, which includes a flexible substrate, a first conductive layer disposed on the flexible substrate and in the first area and the second area, a semiconductor disposed on the flexible substrate and electrically connected to the first conductive layer, a second conductive layer disposed on the first conductive layer, and an organic layer disposed on the first conductive layer and in the first area and the second area. The second conductive layer has a first portion and a second portion are respectively contacted the first conductive layer in the first area. In a cross-sectional view, a first portion of the organic layer is directly contacted the first conductive layer and the second conductive layer and disposed between the first portion and the second portion of the second conductive layer.