Flexible Display Device Wiring Substrate Integration
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Solution Overview
Problem
Current display devices, such as LCDs and AMOLEDs, face challenges like slow response time, short lifespan, and limited flexibility, while semiconductor light emitting devices offer potential for flexible displays but require complex wiring processes and thick substrates.
Innovation Solution
A flexible display device using semiconductor light emitting devices with a simplified wiring structure, featuring a plurality of semiconductor light emitting devices on a wiring substrate connected via a conductive adhesive layer and electrodes, allowing for reduced thickness and enhanced flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If semiconductor light emitting devices are used for flexible displays, then flexibility and lifespan are improved, but wiring process complexity and substrate thickness increase
Solution Approach 1:
The patent merges the connection part with the wiring substrate by forming conductive layers directly on the substrate. The first conductive layer is formed of the same material as the first conductive electrode, and the second conductive layer is formed of the same material as the second conductive electrode, integrating the connection function into the substrate structure rather than using separate complex wiring processes
Solution Approach 2:
The wiring substrate serves multiple functions: it provides mechanical support, electrical connection, and structural integration for the semiconductor light emitting devices. The conductive layers on the substrate simultaneously act as connection paths and structural elements, reducing overall device complexity while maintaining the improved lifespan of semiconductor devices
2Adaptability or versatility
If semiconductor light emitting devices are used for flexible displays, then flexibility is improved, but wiring process complexity increases
Solution Approach 1:
The connection part is merged with the wiring substrate through direct formation of conductive layers on the substrate. This integration simplifies the overall structure by eliminating separate complex wiring processes, allowing the device to maintain flexibility while reducing wiring complexity
Solution Approach 2:
The wiring substrate and conductive layers are designed as thin, flexible structures that can be bent and warped. The integrated connection structure follows the flexible substrate, enabling the entire assembly to adapt to curved surfaces without compromising electrical connectivity or increasing complexity
3Ease of manufacture
If conventional wiring structure is used, then manufacturing is simpler, but device thickness increases
Solution Approach 1:
The patent transitions from a conventional planar wiring structure to a vertically stacked configuration where conductive layers are formed directly on the wiring substrate in the thickness direction. This dimensional reorganization reduces the horizontal footprint and allows for a more compact, thinner overall device structure while maintaining manufacturing feasibility through sequential layer formation
4Speed
If conventional display devices (LCD, AMOLED) are used, then manufacturing is mature, but response time is slow and flexibility is limited
Solution Approach 1:
The patent changes the fundamental material parameter from liquid crystals or organic compounds to inorganic semiconductor materials. This parameter change enables faster response times due to the inherent properties of semiconductor light emitting devices, while the flexible substrate and integrated connection structure simultaneously enable bending and warping capabilities that conventional rigid displays cannot achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a flexible, thin, and lightweight display device with improved response time and lifespan, capable of being warped, bent, or rolled without compromising display quality, while simplifying the wiring process and reducing material thickness.
Implementation Method 1
a first conductive electrode on the first conductive semiconductor layer; and a second conductive electrode on the second conductive semiconductor layer
Implementation Method 2
connected via a conductive adhesive layer and electrodes
Implementation Method 3
semiconductor light emitting devices
Implementation Method 4
semiconductor light emitting devices on a wiring substrate
Data Source
AI summary
A display device including a plurality of semiconductor light emitting devices on a wiring substrate; a connection part on the wiring substrate and configured to electrically-connect the plurality of semiconductor light emitting devices to the wiring substrate. Further, each of the plurality of semiconductor light emitting devices includes a first conductive semiconductor layer; a second conductive semiconductor layer overlapped with the first conductive semiconductor layer; a first conductive electrode on the first conductive semiconductor layer; and a second conductive electrode on the second conductive semiconductor layer. In addition, the connection part includes a first conductive layer formed of a same material as the first conductive electrode and a second conductive layer formed of a same material as the second conductive electrode.