Flexible Electro-Optical Device Resin Film Gap Peeling
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Solution Overview
Problem
In flexible electro-optical devices, the process of peeling the glass substrate bonded to a resin film is challenging, leading to potential breakage and increased manufacturing costs due to the need for protective films that can interfere with the peeling process.
Innovation Solution
A gap is formed between the resin film and the second substrate, allowing for the peeling of the glass substrate without bonding, and a second resin film is applied to protect the conductive lines, eliminating the need for additional protective films and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the drive area is covered with a resin film to protect conductive lines, then the conductive lines are protected, but the glass substrate cannot be peeled from the resin film
Solution Approach 1:
The resin film coverage is segmented: the first resin film covers only the necessary areas (conductive lines and electrodes) while leaving the peeling region exposed. This selective coverage protects conductive lines where needed while enabling glass substrate peeling in the uncovered region, resolving the contradiction between protection and peeling ease.
2Reliability
If a protective film is applied to protect conductive lines during peeling, then the conductive lines are protected, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The first resin film is formed preliminarily during the manufacturing process before peeling occurs. This preliminary formation of the resin film in specific patterns provides both protection and facilitates peeling, eliminating the need for additional protective films and simplifying the overall manufacturing process.
Solution Approach 2:
The resin film is applied with local quality differentiation: the first resin film has specific coverage patterns that provide protection only where conductive lines exist, while the second resin film provides additional protection only in specific regions. This localized approach ensures protection where needed without complicating the peeling process elsewhere.
Data Source
AI summary
According to one embodiment, an electro-optical device comprises a flexible first substrate and a flexible second substrate which include an electro-optical area, a drive area in the first substrate with terminals formed in the drive area, an external drive circuit connected to the terminals, conductive lines extending from the terminals to the electro-optical area side, and a first resin film overlapping the conductive lines. Further, a gap is formed between the first resin film and the second substrate in planar view.