Flexible Electrode Manufacturing via Metal-Oxide Sputtering Seed Layer

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Solution Overview

Problem

Conventional methods for manufacturing flexible electrodes on polymer substrates, such as those using copper electroless plating, face challenges including long process times, limitations in forming fine line widths, and the use of environmentally harmful chemicals due to the necessity of noble metal precursor solutions for seed layer formation.

Innovation Solution

A method involving the formation of a metal-oxide seed layer by sputtering on a plastic substrate, followed by electroless plating, which eliminates the need for noble metal precursors and reduces process time, using a nickel oxide seed layer and an electroless plating bath containing copper sulfate hydrate and ethylenediaminetetraacetic acid, with pH adjustment and ultrasonic cleaning to enhance hydrophilization and precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a noble metal precursor solution is used to form the seed layer, then the seed layer can be formed on the polymer substrate, but the process time becomes long due to drying process

Engineering Contradiction:

Improveseed layer formationVSAvoidprocess time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent extracts and removes the drying process from the seed layer formation sequence by using a water-based slurry that can be directly sintered without prior drying, thereby eliminating the time-consuming drying step while maintaining seed layer quality

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the physical state and composition parameters by using a water-based slurry instead of organic solvent-based precursors, and controls sintering temperature and atmosphere parameters to achieve direct formation of functional seed layers without drying

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If conventional electroless plating is used, then copper plating can be formed, but fine line widths cannot be achieved due to limitations in seed layer formation

Engineering Contradiction:

Improveline width precisionVSAvoidplating quality

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by creating non-uniform seed layer thickness and composition through controlled sputtering and sintering processes, enabling precise control of copper deposition in specific patterns and achieving fine line widths while maintaining overall plating quality

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent replaces the chemical precipitation mechanism of conventional electroless plating with a physical sputtering-deposition mechanism, allowing for more precise control of seed layer formation and enabling finer line width definition

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If noble metal precursor solutions are used for seed layer formation, then seed layers can be formed, but environmentally harmful chemicals are used

Engineering Contradiction:

Improveseed layer formationVSAvoidenvironmental harm

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses inexpensive, environmentally benign water-based slurry materials that can be disposed of without special handling, replacing expensive and hazardous noble metal precursors while maintaining seed layer formation capability

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent converts the potential harm of using water-based slurries (which may cause substrate wetting issues) into a benefit by controlling the sintering process to completely remove moisture and organic binders, resulting in a dry, porous seed layer structure that enhances copper deposition

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces seed layer formation time, minimizes the use of environmentally harmful chemicals, and improves the precision of the metal plating layer, while allowing for the formation of flexible electrodes with improved adhesion and accuracy.

Implementation Method 1

forming a metal-oxide seed layer on the plastic substrate by sputtering a metal oxide on the plastic substrate

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 2

cleaning the plastic substrate includes applying ultrasonic waves to an acetone solution while immersing the plastic substrate in the acetone solution

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 3

forming a metal plating layer on the metal oxide seed layer using an electroless plating

Methodology Applied

Scientific EffectElectroless plating: Electroplating

Data Source

PatentUS10199226B2Method for manufacturing flexible electrode using sputtering process

Publication Date: 2019.02.05 IND ACADEMIC COOPERATION FOUND OF AJOU UNIV

AI summary

There is provided a method for manufacturing a flexible electrode, the method comprising: cleaning a plastic substrate; forming a metal-oxide seed layer on the plastic substrate by sputtering a metal oxide on the plastic substrate; and forming a metal plating layer on the metal oxide seed layer using an electroless plating.