Flexible Electrodes for Uniform Plasma Generation in Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges in generating plasma evenly and attaching electrodes due to thermal expansion and rigidity issues, which affect plasma generation and film formation on semiconductor wafers.
Innovation Solution
The apparatus features flexible electrodes accommodated in protection tubes, with at least a portion bent, allowing easy insertion and removal, and formed by weaving linear conductive members with cores to prevent shrinkage, ensuring consistent plasma generation across multiple wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid electrodes are used in substrate processing apparatus, then plasma generation stability is improved, but electrode attachment and removal becomes difficult due to thermal expansion
Solution Approach 1:
The patent applies this principle by using flexible electrodes made of woven conductive members instead of rigid electrodes. The flexible structure allows the electrodes to accommodate thermal expansion and contraction during heating and cooling cycles, enabling easy attachment to and removal from the processing chamber while maintaining plasma generation stability throughout the process.
Solution Approach 2:
The patent implements dynamics by designing electrodes that can change their physical state - remaining flexible during thermal cycles for easy handling, yet maintaining electrical conductivity and plasma generation capability during operation. The flexible woven structure dynamically adapts to temperature changes without compromising functional performance.
2Ease of operation
If flexible electrodes are used, then electrode attachment and removal becomes easy, but plasma generation uniformity deteriorates
Solution Approach 1:
The flexible woven conductive member structure provides both flexibility for easy handling and sufficient structural integrity to maintain uniform plasma generation. The woven configuration distributes electrical current evenly across the electrode surface, ensuring uniform plasma excitation despite the flexible nature of the material.
Solution Approach 2:
The electrode uses a composite structure of woven conductive members that combines flexibility with electrical conductivity and structural stability. This composite approach allows the electrode to be easily attached and removed while maintaining the uniformity required for consistent plasma generation across the substrate surface.
3Productivity
If electrode surface area is increased, then plasma generation efficiency is improved, but electrode deformation increases
Solution Approach 1:
The flexible woven structure allows the electrode to achieve a large surface area while accommodating deformation through its flexible nature. The woven configuration distributes mechanical stress across multiple threads, preventing localized deformation while maintaining overall electrode integrity and plasma generation efficiency across the expanded surface area.
Solution Approach 2:
The electrode is segmented into multiple woven conductive members rather than a single solid structure. This segmentation allows the electrode to expand to a larger surface area for improved plasma efficiency while the individual woven threads accommodate deformation independently, maintaining overall structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient and uniform plasma generation, reducing deformation and thermal expansion issues, allowing for effective film formation on semiconductor wafers with improved electrode flexibility and surface area, ensuring high-frequency plasma flow.
Implementation Method 1
at least one pair of electrodes which are to bring the processing gas into an active state
Data Source
AI summary
A substrate processing apparatus comprising: a processing chamber which is to accommodate at least one substrate; a gas supply system which is to supply processing gas into the processing chamber; an exhaust system which is to exhaust atmosphere in the processing chamber; and at least one pair of electrodes which are to bring the processing gas into an active state and which are accommodated in protection tubes such that the electrodes can be inserted into and pulled out from the protection tubes, wherein the electrodes are accommodated in the protection tube in a state where at least a portion of the electrodes is bent, and the electrodes are formed of flexible members, is disclosed.


