Flexible Electronic Platform Fabric Integration

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Solution Overview

Problem

Existing wearable electronic devices are inflexible and obtrusive due to their rigid enclosures, which contrast with the stretchable and lightweight nature of fabrics, making them unsuitable for seamless integration with clothing and other textiles.

Innovation Solution

A flexible electronic platform is bonded to fabric using a double-sided adhesive, with conductive adhesive connecting pads on the platform to electrical leads on the fabric, and an additional waterproof layer is applied to create a water-resistant device that can bend and move with the fabric.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If rigid enclosures (metallic snaps, screws, magnets, rigid plastic casing) are used to attach electronic devices to fabric, then structural strength and stability are improved, but flexibility and stretchability deteriorate

Engineering Contradiction:

Improveattachment strengthVSAvoidflexibility and stretchability

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid enclosures with flexible adhesive layers that bond the electronic device to the fabric. The adhesive acts as a flexible shell that maintains structural attachment while allowing the device to stretch and bend with the fabric, eliminating the rigidity problem of traditional metallic or plastic enclosures.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state and properties of the attachment mechanism from rigid (metallic snaps, screws, magnets) to flexible (adhesive material). This parameter change in the attachment layer's mechanical properties enables both strength and flexibility to coexist, as the adhesive can deform elastically while maintaining bond strength.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If thick plastic and adhesive are used to overmold electronic devices onto fabric, then structural stability is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvestructural stabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the thick plastic overmold from the assembly process, retaining only the essential adhesive layer for bonding. This simplification removes unnecessary complexity while maintaining structural stability through the optimized adhesive configuration that directly bonds the electronic device to the fabric without additional molding steps.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The adhesive layer serves multiple functions simultaneously: it provides structural bonding, flexibility, and simplified manufacturing integration. By making the adhesive multi-functional, the patent eliminates the need for separate thick plastic molding and assembly steps, reducing overall device complexity while maintaining stability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If rigid enclosures are used to protect electronic devices, then protection and reliability are improved, but flexibility and comfort deteriorate

Engineering Contradiction:

Improvedevice protectionVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid protective enclosures with a flexible adhesive bonding system that provides protection through direct attachment to the fabric. The adhesive layer acts as a flexible protective interface that secures the electronic device while allowing it to move and flex with the fabric, eliminating the need for rigid protective casings.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a more flexible and compact wearable electronic device that can accommodate a higher number of electrical leads, is easier to manufacture, and integrates well within traditional garment supply chains, offering improved flexibility and water resistance.

Implementation Method 1

A flexible electronic platform is bonded to fabric using a double-sided adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric

Methodology Applied

Scientific EffectConductive adhesion: Adhesive

Data Source

PatentUS11360512B2Electronic device fabric integration

Publication Date: 2022.06.14 INTEL CORP

AI summary

Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.