Flexible Electronic Component with Inorganic Semiconductor Encapsulation
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Solution Overview
Problem
Organic materials used in flexible electronics do not meet the electrical performance requirements for electronic components, compromising the flexibility and functionality of devices.
Innovation Solution
A method for fabricating electronic components that includes a carrier with a first metal layer, a dielectric layer, a semiconductor layer, and a flexible layer with a Young's modulus less than 40 GPa, where the flexible layer encapsulates the metal and semiconductor layers and has openings for electrical connections, enhancing flexibility and maintaining optimal electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If organic materials are used to form electronic components, then the flexibility of the electronic device is enhanced, but the electrical performance becomes far from satisfactory
Solution Approach 1:
The patent employs a composite structure where an inorganic semiconductor layer is formed on an organic flexible substrate. This combination allows the device to simultaneously achieve the flexibility provided by organic materials and the superior electrical performance of inorganic materials. The flexible substrate serves as a base that can be bent and flexed, while the inorganic semiconductor layer provides reliable electrical characteristics for transistor operation.
2Reliability
If inorganic materials are used in the fabrication of electronic components, then the electrical performance is satisfactory, but the flexibility is compromised
Solution Approach 1:
The patent utilizes a flexible substrate as the foundational element upon which inorganic semiconductor layers are deposited. This flexible substrate acts as a thin film that can be bent and deformed without breaking, allowing the entire electronic component to maintain flexibility while the inorganic layers provide the necessary electrical performance for functional operation.
3Adaptability or versatility
If a flexible layer with Young's modulus less than 40 GPa is used to encapsulate inorganic materials, then the overall flexibility is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent specifies a quantitative parameter for the flexible layer's Young's modulus (less than 40 GPa) to ensure adequate flexibility. By defining this specific mechanical property threshold, the invention provides clear manufacturing criteria that balance flexibility requirements with material selection, making the manufacturing process more controllable despite the added layer complexity.
Data Source
AI summary
An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.