Integrated Mold Shell for Flexible Electronic Device Encapsulation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional encapsulation methods for electronic devices require complex and costly mold tooling, exposing devices to high pressure and temperature, and separate mold removal, which can damage electronics and incur significant tooling costs.

Innovation Solution

The method involves using an encapsulation material as a mold shell that integrates with the electronic device, eliminating the need for separate mold tooling by forming a mold shell from the same material as the encapsulant, which remains part of the final product, allowing for low-cost, reliable encapsulation without high-temperature and high-pressure molding techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional mold tooling is used for encapsulation, then the electronic device can be protected from environmental damage, but the tooling costs become significant and the process requires high pressure and temperature

Engineering Contradiction:

Improveprotection from environmental damageVSAvoidcomplex mold tooling

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the mold shell and encapsulant into a single integrated component. The mold shell is formed from the same encapsulation material that will eventually encapsulate the electronic device, eliminating the need for separate complex mold tooling. This integration simplifies the overall system while maintaining the protective function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a disposable mold shell made from the same encapsulation material rather than expensive, reusable metal mold tooling. The mold shell is used once to form the encapsulant around the electronic device and then removed or integrated, eliminating the need for costly, complex, and durable mold tooling infrastructure.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Manufacturing precision

If high pressure and temperature molding is used, then the encapsulation material can be cured effectively, but the electronic device may be damaged

Engineering Contradiction:

Improveencapsulation material curingVSAvoiddamage to electronics

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent performs preliminary actions by forming the mold shell and placing the electronic device inside before introducing the encapsulation material. This allows the electronic device to be protected within the mold shell during the encapsulation process, shielding it from the harmful effects of pressure and temperature while the encapsulant cures.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The mold shell acts as an intermediary between the encapsulation material and the electronic device. It provides a controlled environment for the encapsulation process, allowing the material to be cured effectively while preventing direct exposure of the electronic device to harmful high pressure and temperature conditions.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If separate mold removal is performed, then the encapsulated device can be extracted, but the process becomes complex and time-consuming

Engineering Contradiction:

Improveencapsulation process efficiencyVSAvoidmold removal process

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent merges the mold shell with the final encapsulated product structure. Rather than requiring complex removal mechanisms, the mold shell is designed to be easily separated or integrated into the final product, simplifying the extraction process and improving overall productivity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces damage to electronics, minimizes tooling costs, and simplifies the encapsulation process by integrating the mold shell with the encapsulant, providing a reliable and cost-effective protection for electronic devices without the need for complex mold removal.

Implementation Method 1

curing the encapsulant inside the mold shell such that the encapsulant bonds to the mold shell and the flexible electronic device

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11289393B2Methods, devices, and systems for electronic device molding and encapsulation

Publication Date: 2022.03.29 FLEX LTD

AI summary

Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.