Flexible Electronic Assembly for Non-Planar Surface Attachment
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Solution Overview
Problem
Existing electronic devices face challenges in being applied to non-planar structures due to issues of warpage and compatibility with varying coefficients of thermal expansion, limiting their reliability and flexibility on surfaces like windows, buildings, and car roofs.
Innovation Solution
The electronic device comprises a flexible substrate, an adhesive layer, a metal layer, and a modulating unit, with a manufacturing method that involves a carrier substrate, insulating layers, and a specific sequence of layer formation and removal to alleviate warpage and ensure compatibility with non-planar surfaces, including the use of conductive pads and underfill for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid substrate is used for the electronic device, then manufacturing precision and structural stability are improved, but adaptability to non-planar structures and flexibility are worsened
Solution Approach 1:
The patent employs a flexible substrate instead of a rigid substrate, allowing the electronic device to conform to non-planar surfaces while maintaining structural integrity. The flexible substrate acts as a thin film that can bend and adapt to curved surfaces like windows, buildings, and car roofs, resolving the contradiction between structural stability and adaptability to non-planar structures.
Solution Approach 2:
The patent specifically addresses non-planar structures by designing the electronic device with curved or flexible configurations that can conform to spherical or curved surfaces. This allows the device to be applied to windows, buildings, and other non-planar surfaces while maintaining functional performance, thus improving adaptability without sacrificing structural stability.
2Adaptability or versatility
If materials with different coefficients of thermal expansion are used, then functional performance is improved, but warpage and reliability are worsened
Solution Approach 1:
The patent addresses thermal expansion issues by carefully selecting materials with compatible coefficients of thermal expansion for the substrate, adhesive layer, and functional layers. This parameter matching prevents differential thermal expansion that would cause warpage, thereby maintaining both functional performance and reliability across temperature variations.
Solution Approach 2:
The patent uses a composite structure consisting of multiple layers (substrate, adhesive layer, functional layers) where each layer is selected to have compatible thermal expansion properties. This composite material approach allows the device to maintain structural integrity and avoid warpage while achieving the desired functional performance on non-planar surfaces.
3Device complexity
If the modulating unit is disposed directly on the flexible substrate, then device complexity is reduced, but manufacturing precision and attachment reliability are worsened
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary between the flexible substrate and the modulating unit. This adhesive layer serves as a mediator that ensures precise attachment and reliable bonding while maintaining the overall simplicity of the device structure. The adhesive layer compensates for minor surface irregularities and ensures uniform contact, thereby improving manufacturing precision without significantly increasing device complexity.
Data Source
AI summary
The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a flexible substrate, an adhesive layer, a metal layer, a driving unit, and a modulating unit. The adhesive layer is disposed on the flexible substrate. The metal layer is disposed on the adhesive layer. The driving unit is disposed on the adhesive layer. The modulating unit is disposed on the adhesive layer. The manufacturing method of the electronic device includes the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; providing a flexible substrate, and combining the flexible substrate and the carrier substrate; removing the carrier substrate; and providing a modulating unit, and disposing the modulating unit on the flexible substrate. The electronic device and the manufacturing method thereof of the embodiments of the disclosure may make the electronic device having the modulating unit applicable to a non-planar structure.