Flexible Electronic Layout for Stress-Resistant Semiconductor Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flexible electronic devices experience a reduction in electrical properties and flexibility due to stress, causing deformation and breakage of semiconductor and wire structures when bent.
Innovation Solution
The flexible electronic device design includes a semiconductor structure and a first wire structure with an extending direction forming an included angle of 40° to 70° with the stretching direction of the flexible substrate, and a second wire structure with parallelogram-shaped through holes on the edge, parallel to the substrate's edge line, to minimize stress impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wire structure extends parallel to the channel direction of the semiconductor structure, then the electrical connection is optimized, but the wire structure becomes thinner and longer under stress, making it easily broken
Solution Approach 1:
The patent introduces asymmetric angular orientation for the wire structure relative to the stretching direction. Instead of extending parallel to the channel direction (0° angle), the wire structure is oriented at an angle between 0° and 45° relative to the stretching direction of the flexible substrate. This asymmetric angular configuration allows the wire structure to better withstand tensile stress during bending, preventing it from becoming thinner and longer, thereby maintaining both electrical connection reliability and structural strength.
2Reliability
If the semiconductor structure is subjected to tension force along the channel direction, then the electrical connection is maintained, but the semiconductor structure deforms resulting in change of current flowing through it
Solution Approach 1:
The patent applies asymmetric angular orientation to the semiconductor structure's channel direction relative to the stretching direction of the flexible substrate. The channel direction is oriented at an angle between 0° and 45° relative to the stretching direction, rather than being parallel to it. This asymmetric configuration reduces the tensile force component acting along the channel direction during bending, minimizing deformation and maintaining stable current flow while preserving electrical connection reliability.
3Adaptability or versatility
If the flexible substrate is bent, then the flexibility and extensibility are demonstrated, but the device layer is subjected to stress causing deformation and breakage
Solution Approach 1:
The patent introduces asymmetric angular orientation for both the semiconductor structure and wire structure relative to the stretching direction of the flexible substrate. This asymmetric configuration (angles between 0° and 45°) optimizes the structural response to bending stress, allowing the device layer to maintain integrity while the flexible substrate demonstrates its flexibility and extensibility through bending.
4Device complexity
If the wire structure extends in the same direction as the stress direction, then the layout is simplified, but the wire structure becomes thinner and longer under tension, making it easily broken
Solution Approach 1:
The patent adopts an asymmetric angular layout for the wire structure, orienting it at an angle between 0° and 45° relative to the stretching direction rather than extending it parallel to the stress direction. This asymmetric configuration increases the wire structure's resistance to tensile stress, preventing it from becoming thinner and longer during bending, thereby maintaining wire strength while accepting slightly increased layout complexity.
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
Provided are a flexible electronic device and a manufacturing method thereof. The flexible electronic device (200) comprises a flexible substrate (210) and a device layer formed on the flexible substrate (210). The device layer comprises a semiconductor structure (220) and a wire structure (230) connected to the semiconductor structure, the wire structure (230) having an extension direction same to a channel direction of the semiconductor structure (220). The extension direction of the first wire structure (230) forms an included angle smaller than 90° with respect to a stretching direction of the flexible substrate (210). In the flexible electronic device (200) and manufacturing method thereof of the present invention, the channel direction of the semiconductor structure (220) and the extension direction of the first wire structure (230) are adjusted, such that the semiconductor structure (220) and the first wire structure (230) are least affected by a stress, thus ensuring electrical property and flexibility of the flexible electronic device (200).