Flexible Electronic Device Packaging with Thin Encapsulant
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Solution Overview
Problem
Existing electronic circuit fabrication methods are inefficient and costly, particularly for flexible and stretchable electronics, as they require cumbersome and expensive processes like wire bonding, and conventional packaging solutions increase device thickness and rigidity, making it difficult to integrate small, functional components into flexible systems.
Innovation Solution
A method involving the direct integration of commercial-off-the-shelf electronic components onto flexible substrates using a template structure formed by a mold, allowing for precise attachment and microfabrication processes like metal deposition and photolithography, enabling scalable and cost-effective production of flexible electronic circuits with reduced footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging solutions are used, then electronic components are protected and functional, but device thickness and rigidity increase, making it difficult to integrate into flexible systems
Solution Approach 1:
The patent employs a flexible packaging structure comprising a flexible substrate with a first surface and a second surface, where the electronic component is mounted on the first surface and encapsulated by a thin flexible encapsulant layer. This flexible encapsulation provides component protection while maintaining device flexibility and reducing overall thickness compared to conventional rigid packaging solutions.
2Reliability
If wire bonding processes are used, then electronic components are connected, but fabrication becomes cumbersome and costly
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the fabrication sequence by implementing direct bonding of the electronic component to the flexible substrate. The component is mounted and connected directly during the encapsulation process, removing the need for separate wire bonding steps and reducing overall fabrication complexity and cost.
3Manufacturing precision
If die thinning processing is performed, then component integration is improved, but additional processing steps and time are required
Solution Approach 1:
The patent performs die thinning as a preliminary action before mounting the electronic component onto the flexible substrate. By pre-thinning the die to the desired thickness, the subsequent encapsulation and bonding processes can proceed without requiring additional thinning steps, thereby reducing total processing time while maintaining manufacturing precision.
4Reliability
If conventional fabrication methods are used, then electronic circuits are produced, but scalability and cost-effectiveness are reduced
Solution Approach 1:
The patent employs a universal flexible substrate platform that can accommodate various types of electronic components and circuit configurations. The encapsulation process and bonding techniques are applicable across different component types and scales, enabling standardized fabrication procedures that improve scalability and cost-effectiveness while maintaining circuit functionality.
Data Source
Figure 1A~1D
Figure 2
Figure 3A~3B
AI summary
Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased in the template.