Flexible Electronic Structure With Shielded ACA Bonding
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Solution Overview
Problem
Flexible electronic structures, such as flexible integrated circuits (ICs), are vulnerable to damage during bonding with external circuits due to the high pressure applied by thermodes, which can cause conductive particles in the anisotropic conductive adhesive (ACA) to penetrate the flexible substrate and damage the embedded IC.
Innovation Solution
Incorporating a shield member on the flexible substrate that overlaps at least a portion of the electronic components, designed to withstand the applied pressure and provide structural protection against damaging conductive particles, while also potentially improving the planarity of the contact surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high pressure is applied by thermodes during bonding to ensure adequate contact, then bonding reliability is improved, but the flexible substrate becomes vulnerable to damage from conductive particles penetrating into the electronic components
Solution Approach 1:
A shield member is introduced as an intermediary element between the flexible substrate and the bonding interface. This shield member absorbs the high pressure applied by thermodes during bonding while preventing conductive particles from penetrating into the electronic components, thus resolving the contradiction between bonding reliability and component protection
Solution Approach 2:
The shield member is positioned in advance on the flexible substrate to provide protective cushioning before the bonding process occurs. This pre-positioned shield cushions against the harmful effects of high pressure and conductive particles during the subsequent bonding operation, preventing damage before it can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield member enhances the robustness of the flexible electronic structure during bonding, minimizing the risk of structural damage, short circuits, and other forms of damage to the IC, while also improving the functionality and reducing deformation of the flexible structure.
Implementation Method 1
ACA consists of an adhesive organic binder with a filling material of conductive particles forming a paste... Since the conductive particles are isolated within the non-conductive adhesive matrix, no lateral conduction takes place
Implementation Method 2
A bonding tool (e.g. thermodes) is then used to press (while applying heat) the conductive particles into respective contacts of the flexible circuit structure and the application circuit
Implementation Method 3
thermodes are required to apply a relatively high pressure so as to squeeze the adhesive layer (e.g. ACA) provided between the flexible circuit structure and the application circuit
Implementation Method 4
The binder cures thermally to secure the bond between the flexible circuit structure and the application circuit
Data Source
AI summary
There is provided a flexible electronic structure for bonding with an external circuit, comprising a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, comprising at least one electronic component; at least one contact member, operatively coupled with said at least one electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and at least one shield member, provided at said first surface so as to shieldingly overlap at least a portion of said at least one electronic component, adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.