Flexible Card EMV Connector Arrays for In-Process Personalization
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Solution Overview
Problem
Existing card technologies lack efficient methods for integrating a connector array with discrete connectors arranged in rows and columns, and do not adequately address personalization, testing, and programming during the manufacturing process.
Innovation Solution
A card with a connector array featuring discrete connectors arranged in rows and columns, combined with a personalization layer that allows for programming and testing during the application of the layer, utilizing a flexible substrate and stacked processors for dynamic functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If discrete connectors are arranged in rows and columns on a card surface, then connector integration efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The connector array is segmented into discrete connectors arranged in rows and columns, with each connector being a separate element that can be individually positioned and connected to the substrate. This segmentation allows for systematic integration while maintaining manufacturing feasibility through modular assembly processes.
Solution Approach 2:
The connectors are arranged in a two-dimensional grid pattern (rows and columns) on the card surface, transitioning from traditional single-line or scattered arrangements. This dimensional organization improves integration efficiency by enabling parallel processing and systematic routing, while the structured layout actually simplifies manufacturing through standardized positioning.
2Adaptability or versatility
If personalization layer is applied during manufacturing, then card personalization capability is improved, but process time increases
Solution Approach 1:
The personalization layer is applied during the manufacturing process itself, performing the personalization action in advance rather than as a separate post-manufacturing step. This preliminary action integrates personalization into the core manufacturing flow, enabling customization without adding significant process time.
Solution Approach 2:
The personalization layer application is merged with the existing manufacturing process steps, combining multiple functions (substrate preparation, connector attachment, and personalization) into an integrated workflow. This merging eliminates sequential processing delays and enables simultaneous execution of personalization with other manufacturing operations.
3Reliability
If discrete connectors are separated by personalization layer, then connector isolation is improved, but manufacturing steps increase
Solution Approach 1:
The personalization layer provides localized isolation between discrete connectors, applying the insulating property only where needed between adjacent connectors rather than requiring complete encapsulation. This local quality approach ensures proper connector isolation for electrical reliability while minimizing additional manufacturing complexity by using the same layer for multiple purposes.
Data Source
AI summary
A flexible device, such as a powered card or processor based system, may include a connector array. The connector array may be a contact connector such as an EMV connector. The connector array may include discrete connectors connected to landing pads of a circuit board. The discrete connectors may be exposed on a surface of the flexible device, and may be arranged in rows and columns. The discrete connectors may be formed using vias and by introducing material into the vias. A mask may be used to extend a level of the discrete connectors above an outer layer of the flexible device. A personalization layer may be applied to the flexible device to about a level of an outer surface of the connector. The flexible device may be programmed and tested during the application of the personalization layer.