Flexible Encapsulant Packaging for Thinned Semiconductor Components
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Solution Overview
Problem
Conventional semiconductor packaging technologies are limited by the use of thick growth substrates, which restrict heat dissipation and electrical conduction, and lack flexibility, making them unsuitable for advanced packaging needs.
Innovation Solution
A method of forming a flexible encapsulant over thin and flexible electrical components, allowing for the creation of a flexible semiconductor package that can bend and flex, while providing structural support and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thick growth substrate is used in conventional packaging, then structural support is provided, but heat dissipation and electrical conduction are limited
Solution Approach 1:
The patent changes the physical parameters of the substrate by transitioning from a thick growth substrate to a thin film substrate. This parameter change enables improved heat dissipation and electrical conduction while maintaining structural support through the flexible encapsulant layer.
Solution Approach 2:
The patent employs a thin film substrate replaced by a flexible encapsulant that provides structural support. This thin film approach eliminates the heat dissipation and electrical conduction limitations of thick substrates while maintaining the necessary mechanical support through the flexible encapsulant material.
2Adaptability or versatility
If a thick growth substrate is used in conventional packaging, then structural stability is maintained, but flexibility is lost
Solution Approach 1:
The patent uses a flexible encapsulant as a thin film structure that provides both structural support and flexibility. This replaces the rigid thick growth substrate, enabling the semiconductor device to be bent and adapted to various forms while maintaining structural integrity.
Solution Approach 2:
The patent changes the structural parameters from thick and rigid to thin and flexible. The flexible encapsulant is designed with specific thickness and material properties that enable bending and flexibility while providing adequate structural support for the semiconductor device.
3Temperature
If a flexible encapsulant is used instead of thick substrate, then flexibility and heat management are improved, but structural support must be redesigned
Solution Approach 1:
The patent merges multiple functions into the flexible encapsulant, which simultaneously provides structural support, environmental protection, and heat management. This consolidation eliminates the need for a separate thick growth substrate while achieving improved heat management through the flexible structure.
Solution Approach 2:
The flexible encapsulant is constructed as a composite structure with multiple layers including flexible polymer materials that provide both mechanical support and thermal management properties. This composite design enables the encapsulant to replace the thick substrate while maintaining structural integrity and improving heat dissipation.
Data Source
AI summary
A semiconductor device has a first electrical component and a flexible encapsulant disposed over the first electrical component. The first electrical component is reduced in thickness while in wafer form. The first electrical component has a thickness of 400 micrometers. The first electrical component is attached to a substrate to provide a base to deposit the flexible encapsulant. An interconnect structure is formed over the first electrical component. The flexible encapsulant can be made from polyimide, thermoplastic elastomer, thermoplastic vulcanizate, thermoplastic urethane, or polyvinyl chloride. The interconnect structure has an insulating layer formed over the first electrical component, and a conductive layer formed over the insulating layer as an RDL. A bump can be formed over the conductive layer. The flexible encapsulant can be disposed over a second electrical component. The second electrical component may have a different electrical function from the first electrical component.