Flexible Encapsulating Film for OLEDs

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Solution Overview

Problem

Conventional encapsulation methods for electronic devices, such as OLEDs, using glass and metal caps are costly and result in thicker, heavier devices, while existing flexible encapsulation solutions lack efficient methods for integrating desiccants and adhesives during device fabrication.

Innovation Solution

A flexible encapsulating film system comprising a flexible barrier film with an adhesive and desiccant, designed for lamination onto electronic devices, eliminating the need for separate desiccant and adhesive application during device fabrication, and featuring a singulated system with flexible barrier lids adhered to a carrier web for easier application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass and metal caps are used for encapsulation, then protection from oxygen and moisture is achieved, but device weight and thickness increase

Engineering Contradiction:

Improveprotection from oxygen and moistureVSAvoiddevice weight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent replaces rigid glass and metal encapsulation caps with flexible polymer films that have integrated desiccant layers and adhesive layers. This substitution directly addresses the weight and thickness issues while maintaining protection functionality, as the flexible films are significantly lighter and thinner than traditional glass-metal assemblies.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent creates a composite encapsulation structure consisting of multiple layers: a flexible polymer film base layer, an integrated desiccant layer for moisture absorption, and an adhesive layer for bonding. This composite approach combines the protective function of the film with the moisture-absorbing function of the desiccant and the bonding function of the adhesive, achieving comprehensive protection while maintaining light weight.

Inventive Principle:

Principle #40Composite materials

2Reliability

If glass and metal caps are used for encapsulation, then protection from oxygen and moisture is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveprotection from oxygen and moistureVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the desiccant and adhesive into a single integrated layer structure that is deposited directly onto the flexible film in one manufacturing process. This eliminates the need for separate application steps for desiccant and adhesive, reducing manufacturing complexity and cost while maintaining the protective encapsulation function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The desiccant and adhesive are pre-integrated into the encapsulation film structure during film manufacturing, before the actual device encapsulation process. This preliminary integration means that during device fabrication, no separate desiccant application or adhesive application steps are needed, simplifying the manufacturing process and reducing costs.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If separate desiccant and adhesive application is performed during device fabrication, then encapsulation is achieved, but process complexity increases

Engineering Contradiction:

ImproveencapsulationVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the desiccant and adhesive into a single integrated layer deposited onto the flexible film. This merging eliminates the need for separate application processes for desiccant and adhesive during device fabrication, directly reducing process complexity while ensuring reliable encapsulation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation film is designed as a multi-functional universal component that simultaneously provides structural support (flexible film), moisture protection (integrated desiccant), and bonding (integrated adhesive). This multi-functionality eliminates the need for multiple separate components and application steps, simplifying the overall encapsulation process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible encapsulating film system provides a thinner, lighter encapsulation solution that effectively protects electronic devices from oxygen and moisture, reducing manufacturing costs and simplifying the encapsulation process while maintaining high barrier performance.

Implementation Method 1

an adhesive on at least a portion of the flexible barrier film

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a desiccant on at least a portion of the flexible barrier film or the adhesive

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentUS8846169B2Flexible encapsulating film systems

Publication Date: 2014.09.30 3M INNOVATIVE PROPERTIES CO

AI summary

An encapsulating film system comprises (a) a flexible barrier film, (b) an adhesive on at least a portion of the flexible barrier film, and (c) a desiccant on at least a portion of the flexible barrier film or the adhesive.