Flexible Encapsulation for Environmental Sensitive Elements
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible substrates used in environmental sensitive devices are prone to accelerated aging due to water vapor and oxygen transmission, leading to short device lifespan and damage when bent, which fails to meet commercial durability requirements.
Innovation Solution
A package design incorporating a flexible substrate with an encapsulation layer having a Young's modulus of 5-15 GPa and hardness of 0.4-1.0 GPa, and a water vapor transmittance rate less than 10^-2 g/cm^2 day, which includes a first and second flexible protection layer to absorb bending stress and protect the device from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If flexible substrates are used for ease of carriage and safety, then flexibility and portability are improved, but water vapor and oxygen transmission accelerates device aging and reduces lifespan
Solution Approach 1:
The patent implements a multi-layer encapsulation structure where different protective layers are nested around the environmental sensitive element. The first encapsulation layer, second encapsulation layer, and third encapsulation layer are arranged in nested configuration, with each layer providing specific protection functions. This nested structure effectively blocks water vapor and oxygen transmission while maintaining the flexibility of the substrate, thereby extending device lifespan without sacrificing portability.
Solution Approach 2:
The patent employs composite encapsulation layers with different material properties. The first encapsulation layer has specific Young's modulus (1-10 GPa) and water vapor transmission rate characteristics, while the second and third layers have different mechanical and barrier properties. This composite material approach creates a synergistic effect that provides superior protection against environmental factors while maintaining flexibility, resolving the contradiction between ease of operation and reliability.
2Ease of operation
If flexible substrates are bent for portability, then ease of carriage is improved, but the device is damaged by bending force and cannot operate normally
Solution Approach 1:
The patent applies beforehand cushioning by designing encapsulation layers with specific mechanical properties (Young's modulus of 1-10 GPa for the first layer) that can absorb and distribute bending stresses before they reach the environmental sensitive element. The multi-layer encapsulation structure acts as a protective cushion that prevents damage during flexing operations, enabling the device to be bent for portability without compromising structural integrity or functionality.
Solution Approach 2:
The patent utilizes flexible encapsulation shells and thin films with optimized mechanical properties. The first encapsulation layer, second encapsulation layer, and third encapsulation layer are designed as flexible protective structures that can accommodate bending forces. These flexible shells maintain their integrity during flexing while protecting the internal components, thus enabling ease of carriage without causing damage to the device.
3Reliability
If encapsulation with low water vapor transmittance is used to prevent aging, then device lifespan is improved, but the encapsulation may be too rigid and susceptible to bending damage
Solution Approach 1:
The patent applies local quality by assigning different functional characteristics to different encapsulation layers. The first encapsulation layer is designed with specific Young's modulus (1-10 GPa) and water vapor transmission rate properties for environmental protection, while the second and third layers have different mechanical properties optimized for flexibility and stress distribution. This localized functional differentiation allows each layer to excel at its specific function, collectively providing both environmental protection and bending resistance.
Solution Approach 2:
The patent employs composite encapsulation materials with different mechanical and barrier properties in each layer. The first encapsulation layer provides superior water vapor and oxygen barrier properties, while the second and third layers contribute different mechanical strengths and flexibility characteristics. This composite material strategy creates a synergistic system where the combination of materials provides both environmental protection and resistance to bending forces, resolving the contradiction between reliability and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the durability of environmental sensitive elements by preventing delamination and damage when bent, while maintaining low water vapor transmission and providing UV cutting and light out coupling functions to extend device lifespan and improve light extraction efficiency.
Implementation Method 1
water vapor transmittance rate (WVTR) of the encapsulation is less than 10−2 g/cm2 day
Implementation Method 2
Young's mudulus of the encapsulation ranges from about 5 GPa to about 15 GPa, hardness of the encapsulation ranges from about 0.4 GPa to about 1.0 GPa
Data Source
AI summary
In one embodiment, a package of an environmental sensitive element including a flexible substrate, an environmental sensitive element and an encapsulation is provided. The environmental sensitive element is disposed on the flexible substrate. The encapsulation covers the environmental sensitive element, wherein the Young's mudulus of the encapsulation ranges from about 5 GPa to about 15 GPa, hardness of the encapsulation ranges from about 0.4 GPa to about 1.0 GPa, and water vapor transmittance rate (WVTR) of the encapsulation is less than 10−2 g/cm2 day.