Flexible Encapsulation Multilayer for Display Touch Integration

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Solution Overview

Problem

Display devices with integrated touch screens face deterioration of the thin film encapsulation structure when using flexible films for the upper and lower substrates, leading to compromised display quality due to sensitivity to moisture and oxygen.

Innovation Solution

A display device design featuring a flexible encapsulation multilayer with direct bonding between inorganic materials, which integrates a touch panel without substantial deterioration of the encapsulating characteristics, ensuring protection of the electroluminescent unit and maintaining display quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flexible films are used for upper and lower substrates to enable touch panel integration, then adaptability and ease of operation are improved, but the thin film encapsulation structure deteriorates leading to compromised display quality

Engineering Contradiction:
Improvetouch panel integrationVSAvoidencapsulation structure stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs a composite encapsulation structure consisting of multiple inorganic layers (first inorganic encapsulation layer, second inorganic encapsulation layer) combined with organic layers. This composite approach creates a more robust barrier against moisture and oxygen while maintaining flexibility, thereby preventing encapsulation structure deterioration even when flexible films are used for substrates.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes flexible thin film encapsulation layers that can conform to the flexible substrate requirements. The inorganic encapsulation layers are designed as thin films that provide effective moisture and oxygen blocking while maintaining the overall flexibility of the display device, enabling touch panel integration without compromising encapsulation integrity.

Inventive Principle:
Principle #30Flexible shells and thin films

2Adaptability or versatility

If flexible films are used for substrate, then device flexibility is improved, but moisture and oxygen protection capability deteriorates

Engineering Contradiction:
Improvedevice flexibilityVSAvoidmoisture and oxygen sensitivity
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent combines multiple inorganic encapsulation layers with different properties to create a composite barrier structure. The first inorganic encapsulation layer provides initial protection, while the second inorganic encapsulation layer enhances the barrier performance. This composite material approach achieves effective moisture and oxygen protection while maintaining device flexibility through the thin film design.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies different material properties at different locations and layers of the encapsulation structure. The inorganic layers are strategically positioned to provide targeted protection against moisture and oxygen penetration, with each layer having optimized thickness and material composition for its specific protective function, thereby achieving high barrier performance in a flexible configuration.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11437444B2Display device
Publication Date: 2022.09.06 SAMSUNG DISPLAY CO LTD
  • US11437444B2 patent drawing
  • US11437444B2 patent drawing
  • US11437444B2 patent drawing

AI summary

An electroluminescent device includes a lower structure including an emission area and a peripheral area, a flexible encapsulating multilayer, and a touch panel including a touch electrode. The emission area includes an electroluminescent unit including a lower electrode disposed on an insulating film, an intermediate film, and an upper electrode disposed on the intermediate film. The peripheral area includes an inorganic surface portion substantially surrounding the emission area, various terminals, and wires. A lower surface of the flexible encapsulating multilayer and an upper surface of the inorganic surface portion each include only one or more inorganic materials in direct contact with each other.