Flexible Encapsulation Multilayer for OLED Moisture Barrier
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Solution Overview
Problem
Organic light-emitting display devices are prone to deterioration due to external moisture and oxygen, which can penetrate through the electroluminescent unit, compromising their performance and longevity.
Innovation Solution
An electroluminescent device with a flexible encapsulation multilayer structure that includes an inorganic surface portion and an organic surface portion, where the inorganic surface portion is made of inorganic materials and directly contacts the flexible encapsulation multilayer, forming a sealing region that prevents moisture and oxygen infiltration, while the organic surface portion surrounds the emission area to enhance encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electroluminescent unit is exposed to external environment, then the device structure is simpler and easier to manufacture, but moisture and oxygen penetrate into the electroluminescent unit causing deterioration
Solution Approach 1:
The patent applies flexible encapsulation multilayers consisting of thin film structures to seal the electroluminescent unit. These flexible thin films provide effective barrier protection against moisture and oxygen penetration while maintaining ease of manufacture through conventional thin film deposition techniques, thus resolving the contradiction between manufacturing simplicity and device reliability.
Solution Approach 2:
The patent employs composite encapsulation structures combining multiple materials with different properties (such as inorganic barrier layers and organic flexible layers) to create an effective seal. This composite approach provides both the barrier functionality needed for reliability and the flexibility required for ease of manufacture and device bending.
2Reliability
If a rigid encapsulation structure is used to prevent moisture and oxygen penetration, then reliability is improved, but the device cannot be bent or flexed
Solution Approach 1:
The patent replaces rigid encapsulation with flexible thin film multilayers that can conform to bent surfaces. These flexible encapsulation layers maintain their barrier functionality while allowing the device to be bent or flexed, thus simultaneously achieving both reliability and adaptability.
Solution Approach 2:
The patent changes the physical parameters of the encapsulation material from rigid to flexible by selecting appropriate polymer materials and controlling film thickness. This parameter change enables the encapsulation structure to provide both protection against moisture/oxygen and flexibility for bending applications.
3Reliability
If the encapsulation layer is made thicker to prevent moisture and oxygen penetration, then reliability is improved, but the device becomes bulkier and less thin-type
Solution Approach 1:
The patent uses composite multilayer structures where thin inorganic barrier layers (providing excellent moisture and oxygen barrier properties) are combined with organic flexible layers. This composite approach achieves effective encapsulation with minimal total thickness, preventing the need for thick single-layer encapsulation that would increase device bulk.
Solution Approach 2:
The patent employs ultra-thin flexible film structures that provide effective barrier protection without adding significant thickness to the device. These thin film encapsulation layers maintain device thinness while providing sufficient protection against moisture and oxygen penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture and oxygen penetration, thereby improving the encapsulating properties and extending the lifespan of the electroluminescent device, ensuring reliable operation and maintaining high display quality.
Implementation Method 1
The flexible encapsulation multilayer may be disposed on the emission area and the peripheral area... The peripheral area may include an inorganic surface portion... that directly contacts the lower surface of the flexible encapsulation multilayer
Data Source
AI summary
An electroluminescent device includes a lower structure and a flexible encapsulation multilayer. The lower structure may have an emission area and a peripheral area surrounding the emission area. The flexible encapsulation multilayer may be disposed on the emission area and the peripheral area. The peripheral area may include an inorganic surface portion having a closed shape continuously surrounding the display area and comprising one or more inorganic materials. The flexible encapsulation multilayer may include a lower surface comprising only one or more inorganic materials. The lower surface of flexible encapsulation multilayer may be in direction contact with the inorganic surface portion.


