Flexible Filament Splicing for Continuous LED Light Emission
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Solution Overview
Problem
Current encapsulation equipment cannot effectively handle ultra-long flexible filaments, particularly those with varying specifications and lengths, leading to gaps and interruptions in light emission when connected in series, and requires professional equipment and high production costs for customization.
Innovation Solution
A flexible filament splicing structure comprising multiple flexible filaments with conductive circuit layers and LED chips, where adjacent filaments are electrically spliced using conductive connection ends, soldering, or conductive adhesive, forming an integrated spliced structure that can be bent to desired shapes and lengths, with optional reinforcing plates and layers for enhanced durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multiple flexible filaments are connected in series through tandem module, then the required length can be achieved, but large gaps form between adjacent filaments and light emission continuity is affected
Solution Approach 1:
The flexible filament is divided into multiple segments (first flexible filament and second flexible filament) that are connected through overlapping conductive connection ends. This segmentation allows the filament to be manufactured in manageable lengths while maintaining continuous light emission through the overlapping connection regions where LED chips are positioned to ensure no gaps in light output.
Solution Approach 2:
Conductive connection ends with LED chips are pre-formed on each flexible filament before connection. This preliminary preparation ensures that when filaments are joined, the LED chips at the connection ends are already in position to provide continuous light emission, eliminating gaps that would occur with simple series connection of completed filaments.
2Productivity
If encapsulation equipment is used for fixed specification and length, then production efficiency is maintained, but customization of different specifications and lengths is impossible
Solution Approach 1:
The flexible filament production is segmented into standardized modules (first flexible filament and second flexible filament) that can be manufactured using fixed encapsulation equipment. These modular segments can then be combined in different quantities and configurations to create custom-length filaments, maintaining production efficiency while enabling customization.
Solution Approach 2:
The system transitions from static fixed-length filaments to dynamic configurable lengths by using connectable segments. The number and arrangement of segments can be adjusted based on customer requirements, allowing the same production equipment to produce various specifications by simply changing the number of segments connected.
3Manufacturing precision
If professional equipment and technology are used for gold plating, printing, and patch on flexible PCB, then manufacturing quality is ensured, but production cost increases greatly
Solution Approach 1:
The manufacturing process is segmented into standardized steps (gold plating, printing, patch) that are performed on modular flexible filament segments rather than entire ultra-long filaments. This allows existing professional equipment to be used effectively on smaller, manageable segments, ensuring quality while avoiding the need for expensive customized equipment for ultra-long filament production.
Solution Approach 2:
Instead of investing in expensive customized equipment for ultra-long filament production, the patent uses standard professional equipment on disposable or replaceable modular segments. This approach trades the high capital cost of customized equipment for the lower cost of standard equipment plus the modular segment production process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous light emission without interruptions, simplifies production by allowing flexible filament customization to specific lengths and shapes, and reduces production costs by eliminating the need for specialized equipment.
Implementation Method 1
The two adjacent flexible filaments may be electrically spliced with each other by soldering
Implementation Method 2
the two adjacent flexible filaments may be bonded to be electrically spliced through a conductive adhesive
Data Source
AI summary
The embodiments of the present disclosure provide a flexible filament splicing structure, comprising a plurality of flexible filaments. Each of the plurality of flexible filaments includes a flexible substrate and at least one LED chip. The flexible substrate is provided with a conductive circuit layer. The at least one LED chip is disposed on the flexible substrate. The at least one LED chip is electrically connected with the conductive circuit layer. Two adjacent flexible filaments are electrically spliced with each other to enable the plurality of flexible filaments to form an integrated spliced structure.