Flexible Thin Film Backside Driver Connection for Narrow LCD Frames

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Solution Overview

Problem

The existing side bonding technique for liquid crystal display (LCD) devices requires the chip on film and driver chip to be disposed on the side surface of the panel, occupying space and making it difficult to achieve narrow frames in LCDs.

Innovation Solution

A display panel design featuring a flexible thin film on the backside of the array substrate, with first and second wires extending from the side surface to the opposite surface, allowing the driver chip to be connected electrically through the flexible thin film, thereby reducing the need for side surface space and enabling narrower frames.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the chip on film and driver chip are disposed on the side surface of the array substrate using side bonding technique, then electrical connection between liquid crystal cell circuit and driver chip is achieved, but space on the side surface is occupied which is unfavorable for achieving narrow frames

Engineering Contradiction:
Improveelectrical connectionVSAvoidside surface space
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent transitions from placing the flexible thin film on the side surface (2D surface mounting) to placing it on the backside of the array substrate (3D spatial relocation). This dimensional change allows the flexible thin film to be positioned in a different spatial plane, freeing up side surface area for narrow frame design while maintaining electrical connection functionality through wires extending from the first surface to the second surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the flexible thin film is disposed on the backside of the array substrate, then space on the side surface is reduced enabling narrower frames, but the structure becomes more complex with wires extending through the substrate

Engineering Contradiction:
Improveside surface spaceVSAvoidwire structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent divides the electrical connection path into multiple segments: first wires on the first surface, second wires extending through the substrate thickness from the first surface to the second surface. This segmentation allows each component to be optimized independently and simplifies the overall implementation by breaking down the complex through-substrate connection into manageable sections that can be fabricated using standard processes.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11415843B2Display panel and liquid crystal display device
Publication Date: 2022.08.16 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US11415843B2 patent drawing
  • US11415843B2 patent drawing

AI summary

The present disclosure provides a display panel and a liquid crystal display device. The display panel includes an array substrate and a flexible thin film. The array substrate has a first surface, a second surface disposed opposite to and in parallel with the first surface, and a first side surface connected to the first surface and the second surface. The first surface of the array substrate is on a same side as a light-emitting surface of the array substrate, and the flexible thin film is disposed on a side of the second surface of the array substrate. The display panel and the liquid crystal display device have narrow frames.