Flexible Film Microprocessor for Vaping Device Control

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Solution Overview

Problem

Existing electronic vapor devices lack flexible and adaptable processor technologies that can conform to the shape of vaping devices, limiting their control and functionality.

Innovation Solution

A microprocessor is created by printing processor elements onto a flexible film substrate, such as polyimide film or transparent conductive polyester, allowing for flexible and printable integration within vaping devices, including air intake, vapor output, and heating elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a rigid processor is used for controlling vaping devices, then the processor can be manufactured with standard processes, but it cannot conform to the shape of the vaping device

Engineering Contradiction:

Improveconformability to device shapeVSAvoidprocessor structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies flexible film technology to create a processor that can conform to the shape of the vaping device. The processor is constructed on a flexible substrate that can be bent and shaped to match the device contours, while maintaining electrical functionality through flexible circuit board techniques and flexible component mounting.

Inventive Principle:

Principle #30Flexible shells and thin films

2Adaptability or versatility

If traditional processor manufacturing is used, then production is standardized, but flexibility and customization are limited

Engineering Contradiction:

Improvecustomization capabilityVSAvoidmanufacturing process

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The processor is divided into modular functional blocks that can be independently designed, manufactured, and assembled on the flexible substrate. This segmentation allows for customization of different device configurations while using standardized manufacturing processes for each module.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes flexible substrate materials with adjustable physical and electrical parameters. By changing material properties such as flexibility, thickness, and conductivity, the processor can be adapted to different device requirements while maintaining ease of manufacture through controlled parameter variations.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If a flexible film substrate is used for the processor, then the processor can conform to device shapes, but manufacturing precision may be compromised

Engineering Contradiction:

ImproveflexibilityVSAvoidcircuit element placement

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The flexible substrate and circuit patterns are pre-configured with precise positioning features before final assembly. Alignment marks, pre-positioned mounting holes, and pre-routed conductive traces are prepared in advance to ensure accurate component placement and electrical connections during assembly.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs advanced flexible film technologies that maintain dimensional stability and precision during manufacturing. The flexible substrate incorporates rigidifying layers or tensioning mechanisms that enable precise circuit element placement while preserving the overall flexibility needed for device conformance.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the development of advanced electronic vapor devices with enhanced control and customization, improving user experience through flexible integration and mass production capabilities.

Implementation Method 1

a heating element configured for heating the vaporizable material and the received air to generate a heated vapor

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

The microprocessor can be created by printing the processor elements onto a film based surface

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS10085486B2Electronic vapor device with film assembly

Publication Date: 2018.10.02 LUNATECH LLC

AI summary

Disclosed are methods, systems, and apparatuses for fabricating a film based processor and using the processor in an electronic vaping device. An example apparatus can comprise an air intake, a vapor output, a container for storing a vaporizable material, a mixing chamber coupled to the air intake for receiving air, the container for receiving the vaporizable material, and a heating element configured for heating the vaporizable material and the received air to generate a heated vapor. The apparatus can comprise a processor comprising a plurality of circuit elements supported on a flexible film substrate.