Flexible Film Processing Probe for Semiconductor Parameter Measurement

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Solution Overview

Problem

Semiconductor processing tools face challenges in accurately controlling processing parameters and preventing contamination, as traditional monitoring methods are intrusive and cannot replicate the actual conditions experienced by semiconductor workpieces, leading to issues with contamination and uniformity.

Innovation Solution

A self-contained Processing Probe Apparatus (PPA) with sensors, an analog-to-digital converter, and communication devices attached to a flexible film, mimicking a semiconductor workpiece, allows for non-intrusive measurement of processing conditions within the tool, transmitting data for real-time analysis and dynamic control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional monitoring methods are used to measure processing parameters, then measurement capability is provided, but contamination and intrusion into the processing tool occur

Engineering Contradiction:

Improveprocessing parameter measurementVSAvoidcontamination

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent uses a dummy workpiece that copies the physical characteristics and dimensions of an actual semiconductor workpiece without containing sensitive devices. This dummy workpiece is equipped with sensors to measure processing parameters, allowing non-intrusive monitoring that prevents contamination while maintaining measurement capability

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The dummy workpiece serves as an intermediary between the processing tool and the measurement system. It transfers the mechanical and thermal conditions experienced by actual workpieces to sensors without introducing contamination, acting as a mediator that enables measurement while protecting the processing environment

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of information

If intrusive monitors are used to record processing conditions, then data collection is enabled, but processing uniformity and contamination control are compromised

Engineering Contradiction:

Improveprocessing condition dataVSAvoidprocessing uniformity

Core Design Contradiction:

Loss of informationVSManufacturing precision

Solution Approach 1:

The dummy workpiece replicates the geometry, material properties, and surface characteristics of actual semiconductor workpieces. This copying approach allows the dummy to experience identical processing conditions without the sensitivity of real devices, enabling comprehensive data collection while maintaining processing uniformity

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The dummy workpiece is self-contained with integrated sensors, power sources, and data storage capabilities. It autonomously measures and records processing conditions during manufacturing cycles, eliminating the need for external intrusive monitoring equipment that would compromise processing uniformity

Inventive Principle:

Principle #25Self-service

3Object-affected harmful factors

If a monitoring device resembles a semiconductor workpiece and is transferred like an actual workpiece, then contamination control is satisfied, but device complexity increases

Engineering Contradiction:

Improvecontamination controlVSAvoidmonitoring device structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The monitoring device is segmented into modular components: a dummy workpiece body, sensor array, power source, and communication interface. This segmentation allows each component to be optimized independently while maintaining the overall simplicity of transferring a workpiece-like object through standard tooling interfaces

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dummy workpiece utilizes flexible thin-film technology to integrate sensors, wiring, and power sources onto a substrate that mimics the appearance and handling characteristics of actual semiconductor workpieces. This approach maintains contamination control by resembling real workpieces while managing device complexity through planar integration techniques

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS11724354B2Apparatus and method for determining parameters of process operation

Publication Date: 2023.08.15 IONEER LLC

AI summary

Various examples of the present technology disclose a self-contained and programmable Processing Probe Apparatus (PPA) that can measure processing properties of a processing tool. The PPA comprises one or more sensors, an analog-to-digital converter and information (ADCI) processor, an electrical power source (EPS), and a digital signal communication device, all of which are attached to a flexible film. The flexible film can be mounted on a substrate that mimics a semiconductor workpiece.